Shenzhen Bicheng Electronics Technology Co., Ltd
深圳市碧澄电子科技有限公司
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Hybrid PCB Built on RTduroid 5880 and RO4003C 4-layer 50mil

Shipped: 11th-MAR-2024  

 

1. Introduction of RT/duroid 5880 and RO4003C
Rogers RT/duroid 5880 high frequency laminates are PTFE composites reinforced with glass microfibers. It has a low dielectric constant (Dk) and low dielectric loss, making them well suited for high frequency/broadband applications. Helping to maintain the Dk uniformity are the randomly oriented microfibers reinforcing the PTFE composites.

 
Rogers RO4003C materials are proprietary woven glass reinforced hydrocarbon/ceramics with the electrical performance of PTFE/woven glass and the manufacturability of epoxy/ glass. RO4003C laminates provide tight control on dielectric constant (Dk) and low loss while utilizing the same processing method as standard epoxy/glass but at a fraction of the cost of conventional microwave laminates. Unlike PTFE based microwave materials, no special through-hole treatments or handling procedures are required.
 
2.1 Featrues of RT/duroid 5880
Dk or 2.20 +/- .02
Dissipation factor of .0009 at 10GHz
Low moisture absorption
Isotropic
 
2.2 Features of RO4003C
Dk of 3.38 +/- 0.05
Dissipation factor of 0.0027 at 10 GHz
Low Z-axis coefficient of thermal expansion at 46 ppm/°C
 
3. Benefits of RT/duroid 5880 and RO4003C hybrid.
- Enhanced electrical performance: RT/duroid 5880 is known for its low loss and stable high dielectric constant (Dk) across a wide frequency range. RO4003C, on the other hand, provides low loss and excellent electrical properties. When combined, these materials can optimize the electrical performance of the PCB, ensuring reliable signal integrity and minimal signal loss.
 
- Improved thermal management: RO4003C has high thermal conductivity of 0.71W/mk, which helps dissipate heat more effectively. By incorporating RO4003C layers in areas prone to heat generation, such as power components or high-power RF sections, the hybrid PCB can enhance thermal management and prevent overheating issues.
 
- Design flexibility: The combination of RT/duroid 5880 and RO4003C allows for greater design flexibility. Different layers of the PCB can be composed of either material, enabling engineers to achieve the desired electrical and thermal characteristics in specific regions of the board. This flexibility aids in optimizing the PCB layout and meeting the requirements of complex high-frequency designs.
- Cost-effectiveness: Hybrid PCBs utilizing RT/duroid 5880 and RO4003C can offer cost benefits compared to using a single material throughout the board. By strategically selecting the appropriate material for specific areas based on performance requirements, engineers can achieve the desired functionality while optimizing costs.
 
- Wide frequency range: The combination of RT/duroid 5880 and RO4003C expands the utility of the hybrid PCB across a wide frequency range. These materials are suitable for applications ranging from microwave frequencies to the higher-frequency bands, such as the Ku-band and beyond. This versatility allows the hybrid PCB to be utilized in various high-frequency and broadband applications.
- Reliability and durability: Both RT/duroid 5880 and RO4003C are known for their high-quality construction and reliability. When combined in a hybrid PCB, they contribute to the overall durability and long-term performance of the board, making it suitable for demanding applications that require robustness and stability.
4. PCB Stack-up: 4-layer rigid PCB
Copper_layer_1 - 35 μm
RT/duroid 5880 Core - 0.787mm (31mil)
Copper_layer_2 - 35 μm
Prepreg - RO4450F x 2 - 0.203mm (8mil)
Copper_layer_1 - 35 μm
RO4003C Core - 0.203mm (8mil)
Copper_layer_2 - 35 μm
 
5. PCB Construction details:
- Board dimensions: 109mm x 71.57 mm=1PCS, +/- 0.15mm
- Minimum Trace/Space: 4/4 mils
- Minimum Hole Size: 0.3mm
- No Blind vias.
- Finished board thickness: 1.3mm
- Finished Cu weight: 1oz (1.4 mils) each layer
- Via plating thickness: 20 μm
- Surface finish: Immersion Gold
- Top Silkscreen: White
- Bottom Silkscreen: No
- Top Solder Mask: Green
- Bottom Solder Mask: No
- 100% Electrical test used prior to shipment
 
6. PCB Statistics:
Components: 68
Total Pads: 117
Thru Hole Pads: 72
Top SMT Pads: 45
Bottom SMT Pads: 0
Vias: 87
Nets: 5
 
7. Type of artwork supplied: Gerber RS-274-X
 
8. Quality standard: IPC-Class-2
 
9. Availability: worldwide
 
10. Some Typical Applications:
- Automotive Radar and Sensors
- Commercial Airline Broadband Antennas
- Microstrip and Stripline Circuits
- Millimeter Wave Applications
- Point to Point Digital Radio Antennas
  PCBBACK TO MARCH
　

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