Hybrid PCB of RTduroid 5880 and RO4003C PCB Supplier

WELCOME TO BICHENG

Home
Company
Quality
Manufacture
Career
PCB Boards
- Newly Shipped RF PCB
- High Frequency PCB
Contact Us

Hybrid PCB of RTduroid 5880 and RO4003C 4-layer 1.33mm Thick

Shipped: 5th-July-2024

1.1 Introduction of RT/duroid 5880
Rogers RT/duroid 5880 high frequency laminates are PTFE composites reinforced with glass microfibers. It has a low dielectric constant (Dk) and low dielectric loss, making them well suited for high frequency/broadband applications. Helping to maintain the Dk uniformity are the randomly oriented microfibers reinforcing the PTFE composites.

1.2 Introduction of RO4003C
Rogers RO4003C materials are proprietary woven glass reinforced hydrocarbon/ceramics with the electrical performance of PTFE/woven glass and the manufacturability of epoxy/ glass.

RO4003C laminates provide tight control on dielectric constant (Dk) and low loss while utilizing the same processing method as standard epoxy/glass but at a fraction of the cost of conventional microwave laminates. Unlike PTFE based microwave materials, no special through-hole treatments or handling procedures are required.

RO4003C materials are non-brominated and are not UL 94 V-0 rated.

2.1 Features (RT/duroid 5880)
- Dielectric constant of 2.2 with tight tolerance 0.02 at 10 GHz/23°C
- Dissipation factor of 0.0009 at 10GHz
- Temperature coefficient of dielectric constant (TCDk) of -125 ppm/°C
- Low Moisture Absorption 0.02%
- CTE in X-axis of 31 ppm/°C, Y-axis of 48 ppm/°C and Z-axix of 237 ppm/°C
- Isotropic

2.2 Feastures (RO4003C)
- Dielectric Constant of DK 3.38 +/-0.05 at 10GHz
- Dissipation Factor of 0.0027 at 10GHz
- Thermal Conductivity of 0.71 W/m/°K
- Thermal Coefficient of Dielectric Constant at +40 ppm/°C，ranging -50°C to 150°C
- CTE matched to copper with X axis of 11ppm/°C, Y of 14ppm/°C
- Low Z-axis coefficient of thermal expansion at 46 ppm/°C
- Tg >280 °C
- Low Moisture Absorption of 0.06%

3. PCB Stackup: 4-layer rigid PCB
Copper_layer_1 - 35 μm
RT/duroid 5880 - 0.787 mm (31mil)
Copper_layer_2 - 35 μm
RO4450F - Prepreg bondply- 0.101mm (4mil)
Copper_layer_3 - 35 μm
RO4003C - 0.203 mm (8mil)
Copper_layer_4 - 35 μm

4. PCB Construction details:
- Board dimensions: 110mm x 51mm=1PCS, +/- 0.15mm
- Minimum Trace/Space: 4/6 mils
- Minimum Hole Size: 0.3mm
- No Blind vias.
- Finished board thickness: 1.3mm
- Finished Cu weight: 1oz (1.4 mils) inner/outer layers
- Via plating thickness: 20 μm
- Surface finish: Immersion Gold
- Top Silkscreen: White
- Bottom Silkscreen: No
- Top Solder Mask: Green
- Bottom Solder Mask: No
- 100% Electrical test used prior to shipment

5. PCB Statistics:
Components: 41
Total Pads: 85
Thru Hole Pads: 54
Top SMT Pads: 31
Bottom SMT Pads: 0
Vias: 52
Nets: 5

6. Type of artwork supplied: Gerber RS-274-X

7. Accepted standard: IPC-Class-2

8. Availability: worldwide

9. Some Typical Applications:
- Commercial Airline Broadband Antennas
- Microstrip and Stripline Circuits
- Millimeter Wave Applications
- Radar Systems
- Guidance Systems
- Point to Point Digital Radio Antennas

BACK TO JULY

Tags Printed Circuit Board, High Frequency PCB, RF PCB, Microwave PCB, Rogers PCB, Rogers RO3003, RO3003G2, RO3010, RO3006, RO3035, RO3203, RO3206, RO3210, Rogers RO4003C, RO4350B, RO4360G2, RO4725JXR, RO4730G3, RO4533, RO4534, RO4535, RO4830, RO4835, RT/duroid 5880, RT/duroid 5870, RT/duroid 6002, RT/duroid 6010, RT/duroid 6035HTC, Rogers TMM3, TMM4, TMM6, TMM10, TMM10i, TMM13i, Rogers Kappa438, CLTE-XT, AD250C, AD255C, AD300D, AD350A, AD450, AD600, AD1000, TC350, TC600, DiClad 880, DiClad 870, DiClad 527, IsoClad 917; Taconic PCB, TLF-35, RF-35TC, RF-60A, RF-60TC, RF-35A2, RF-35, RF-45, RF-10, TRF-45, TLX-0, TLX-9, TLX-8, TLX-7, TLX-6, TLY-3, TLY-5, TLY-5Z, TSM-DS3, PTFE PCB, Wangling RF PCB, F4BM220, F4BME220, F4BTM220, F4BTME220, F4BTMS220