Hybrid PCB of RO4003C and FR-4 Supplier

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Hybrid PCB of RO4003C and FR-4 6-layer 1.1mm Thick

Shipped: 3rd-July-2024

1. Introduction of RO4003C
Rogers RO4003C materials are proprietary woven glass reinforced hydrocarbon/ceramics with the electrical performance of PTFE/woven glass and the manufacturability of epoxy/ glass.

RO4003C laminates provide tight control on dielectric constant (Dk) and low loss while utilizing the same processing method as standard epoxy/glass but at a fraction of the cost of conventional microwave laminates. Unlike PTFE based microwave materials, no special through-hole treatments or handling procedures are required.

RO4003C materials are non-brominated and are not UL 94 V-0 rated.

2.1 Feastures (RO4003C)
- Dielectric Constant of DK 3.38 +/-0.05 at 10GHz
- Dissipation Factor of 0.0027 at 10GHz
- Thermal Conductivity of 0.71 W/m/°K
- Thermal Coefficient of Dielectric Constant at +40 ppm/°C，ranging -50°C to 150°C
- CTE matched to copper with X axis of 11ppm/°C, Y of 14ppm/°C
- Low Z-axis coefficient of thermal expansion at 46 ppm/°C
- Tg >280 °C
- Low Moisture Absorption of 0.06%

2.2 Features (S1000-2M)
-Lower Z-Axis CTE for improved throughhole reliability
-Excellent Mechanical Processability andThermal Resistance
-Leadfree Compatible
-Tg180℃ (DSC), UV Blocking/AOI compatible
-High heat resistance
-Excellent Anti-CAF performance
-Low water absorption

3. PCB Stackup: 6-layer rigid PCB
Copper_layer_1 - 35 μm
RO4003C - 0.305 mm (12mil)
Copper_layer_2 - 35 μm
Prepreg bondply- 1080 RC63% 0.0644mm (2.5mil)
Copper_layer_3 - 35 μm
FR-4 Tg170 0.076 - 0.203 mm (3mil)
Copper_layer_4 - 35 μm
Prepreg bondply- 1080 RC63% 0.0644mm (2.5mil)
Copper_layer_3 - 35 μm
RO4003C - 0.305 mm (12mil)
Copper_layer_4 - 35 μm

4. PCB Construction details:
- Board dimensions: 83.50mm x 66mm=1PCS, +/- 0.15mm
- Minimum Trace/Space: 4/4 mils
- Minimum Hole Size: 0.2mm
- No Blind vias.
- Finished board thickness: 1.1mm
- Finished Cu weight: 1oz (1.4 mils) inner/outer layers
- Via plating thickness: 20 μm
- Surface finish: Immersion Gold
- Top Silkscreen: White
- Bottom Silkscreen: No
- Top Solder Mask: Matt Green
- Bottom Solder Mask: Matt Green
- Impedance control on 4mil / 4mil traces/gaps top layer, 50 ohm
- Print series number
- 0.2mm via filled and capped
- 100% Electrical test used prior to shipment

5. PCB Statistics:
Components: 51
Total Pads: 82
Thru Hole Pads: 53
Top SMT Pads: 29
Bottom SMT Pads: 0
Vias: 49
Nets: 6

6. Type of artwork supplied: Gerber RS-274-X

7. Accepted standard: IPC-Class-2

8. Availability: worldwide

9. Some Typical Applications:
- Commercial Airline Broadband Antennas
- Microstrip and Stripline Circuits
- Millimeter Wave Applications
- Radar Systems
- Guidance Systems
- Point to Point Digital Radio Antennas

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