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Hybrid PCB of RO3210 and RO3003 3-layer 3mm Thick

Shipped: 1st-July-2024

1.1 Introduction of RO3210
Rogers' RO3210 high frequency circuit materials are ceramic-filled laminates reinforced with woven fiberglass. These materials are engineered to offer exceptional electrical performance and mechanical stability with one distinguishing characteristic - improved mechanical stability.

RO3210 laminates combine the surface smoothness of a non-woven PTFE laminate, for finer line etching tolerances, with the rigidity of a woven-glass PTFE laminate. These materials can be fabricated into printed circuit boards using standard PTFE circuit board processing techniques.

1.2 Introduction of RO3003
Rogers RO3003 high frequency laminates are ceramic-filled PTFE composites for use in commercial microwave and RF applications. RO3003 laminates offer excellent stability of dielectric constant (Dk) over various temperatures and frequencies. This stability also includes the elimination of the step change in Dk that typically occurs near room temperature with PTFE glass materials. This is ideal for applications including automotive radar (77 GHz), advanced driver assistance systems (ADAS) and 5G wireless infrastructure (mmWave).

2.1 Features (RO3210)
- Dk of 10.2 +/- 0.5
- Dissipation factor of .0027 at 10GHz
- Coefficient of thermal expansion matched to copper - x y z : 13 ppm/°C, 13 ppm/°C, 34 ppm/°C
- Decomposition Temperature (Td) of 500 °C TGA
- Thermal Conductivity of 0.81W/mk
- Flammability of V0 UL 94 standard

2.2 Features (RO3003)
- Rogers RO3003 ceramic-filled PTFE composites
- Dielectric constant of 3+/- 0.04 at 10 GHz/23°C
- Dissipation factor of 0.001 at 10 GHz/23°C
- Td> 500°C
- Thermal Conductivity of 0.5 W/mK
- Moisture Absorption of 0.04%
- Coefficient of Thermal Expansion (-55 to 288 °C)：X axis 17 ppm/°C, Y axis 16 ppm/°C, Z axis 25 ppm/°C

3. PCB Stackup: 3-layer rigid PCB
Copper_layer_1 - 35 μm
Rogers RO3003 Core - 1.524 mm (60mil)
RO4450F - Bondply - 0.101mm (4mil)
Copper_layer_1 - 35 μm
Rogers RO3210 Core - 1.27 mm (50mil)
Copper_layer_1 - 35 μm

4. PCB Construction details:
- Board dimensions: 62.8mm x 62.8 mm=1PCS, +/- 0.15mm
- Minimum Trace/Space: 7/9 mils
- Minimum Hole Size: 0.4mm
- No Blind vias.
- Finished board thickness: 3.0mm
- Finished Cu weight: 1oz (1.4 mils) outer layers
- Via plating thickness: 20 μm
- Surface finish: Immersion Tin
- Top Silkscreen: No
- Bottom Silkscreen: No
- Top Solder Mask: No
- Bottom Solder Mask: No
- 100% Electrical test used prior to shipment

5. PCB Statistics:
Components: 21
Total Pads: 47
Thru Hole Pads: 35
Top SMT Pads: 12
Bottom SMT Pads: 0
Vias: 24
Nets: 4

6. Type of artwork supplied: Gerber RS-274-X

7. Quality standard: IPC-Class-2

8. Availability: worldwide

9. Some Typical Applications:
- Automotive collision avoidance systems
- Automotive global positions satellite antennas
- Wireless telecommunications systems
- Microstrip patch antennas for wireless communications
- Direct broadcast satellites
- Datalink on cable systems
- Remote meter readers
- Power backplanes
- LMDS and wireless broadband
- Base station infrastructure

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