Hybrid PCB Built on RO4003C and S1000-2M

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Hybrid PCB Built on RO4003C and S1000-2M with 4-Layer Build-up and Immersion Gold

Shipped: 6th-Oct-2023

We are thrilled to announce the arrival of our latest shipment of a type of hybrid PCBs. Hybrid printed circuit boards (PCBs) offer a versatile solution for various applications, combining different materials to achieve specific performance characteristics.

Laminate Introduction
RO4003C: High-Performance Hydrocarbon Ceramic Material
RO4003C is a hydrocarbon ceramic woven glass material offered by Rogers. It exhibits the following key properties:
Dielectric Constant (DK) at 10 GHz: 3.38
Dissipation Factor at 10 GHz: 0.0027
High Temperature Performance: Tg > 280 °C, Td > 425 °C

FR-4 (S1000-2M): High Tg Epoxy Glass Material
FR-4 (S1000-2M) is a high Tg, low CTE epoxy glass material by Shengyi. It offers the following features:
Dielectric Constant (DK) at 1 GHz: 4.6
Dissipation Factor at 1 GHz: 0.0018
High Temperature Performance: Tg > 185 °C, Td > 180 °C

PCB Stackup Configuration: 4-Layer Rigid PCB
The stackup configuration for the hybrid PCB consists of the following layers:
Copper Layer 1: 35 μm (1oz)
Rogers 4003C Core: 12 mil (0.305 mm)
Copper Layer 2: 35 μm (1oz)
Prepreg: 0.1 mm
Core S1000-2M FR-4
Prepreg: 0.1 mm
Copper Layer 1: 35 μm (1oz)
Rogers 4003C Core: 12 mil (0.305 mm)
Copper Layer 2: 35 μm (1oz)

PCB Construction Details and Specifications
Board Dimensions: 76 mm x 65 mm = 1PCS, +/- 0.15 mm
Minimum Trace/Space: 4/7 mils
Minimum Hole Size: 0.2 mm
No Blind Vias
Finished Board Thickness: 1.6 mm
Finished Cu Weight: 1oz (1.4 mils) each layer
Via Plating Thickness: 25 μm
Surface Finish: Immersion Gold (ENIG)
Top and Bottom Silkscreen: White
Top and Bottom Solder Mask: Red
Controlled Impedance: Top 6 mil / 7 mils trace and gap with 50-ohm differential impedance
100% Electrical Test Used Prior to Shipment

PCB Statistics
Components: 29
Total Pads: 87
Thru-Hole Pads: 44
Top SMT Pads: 32
Bottom SMT Pads: 11
Vias: 70
Nets: 5

Artwork and Quality Standards
Type of Artwork Supplied: Gerber RS-274-X
Quality Standard: IPC-Class-2
Availability: Worldwide

Typical Applications:
Cellular Base Station Antennas and Power Amplifiers
RF Identification Tags
Automotive Radar and Sensors
LNB's for Direct Broadcast Satellites

Parameter	Value
1.1 PCB Material RO4003C	(1) Rogers RO4003C Hydrocarbon Ceramic woven glass
	(2)Dielectric Constant of DK 3.38 at 10 GHz
	(3) Dissipation Factor of 0.0027 at 10GHz
	(4) Tg >280 °C, Td> 425°C
1.2 PCB Material FR-4 (S1000-2M)	(1) Shengyi High Tg, Low CTE Epoxy Glass
	(2) Dielectric Constant of DK 4.6 at 1 GHz
	(3) Dissipation Factor of 0.0018 at 1 GHz
	(4) Tg >185 °C, Td> 180°C
2. Features and Attentions	Offered in various configurations, RO4003C laminates utilize both 1080 and 1674 glass fabric styles with all configurations meeting the same laminate electrical performance specification. RO4003C laminates provide tight control on dielectric constant (Dk) and low loss while utilizing the same processing method as standard epoxy/glass but at a fraction of the cost of conventional microwave laminates. RO4003C materials are non-brominated and are not UL 94 V-0 rated.
	While S1000-2M features anti-CAF capability, lead-free compatibility, excellent thermal and through-hole reliability, as well as exceptional mechanical processability.
3. Stackup: 4-layer rigid PCB	Copper_layer_1 - 35 μm (1oz)
	Rogers 4003C Core - 12mil (0.305mm)
	Copper_layer_2 - 35 μm (1oz)
	Prepreg - 0.1mm
	Core S1000-2M FR-4
	Prepreg -0.1mm
	Copper_layer_1 - 35 μm (1oz)
	Rogers 4003C Core - 12mil (0.305mm)
	Copper_layer_2 - 35 μm (1oz)
4. Construction details	Board dimensions: 76mm x 65 mm=1PCS, +/- 0.15mm
	Minimum Trace/Space: 4/7 mils
	Minimum Hole Size: 0.2mm
	No Blind vias.
	Finished board thickness: 1.6mm
	Finished Cu weight: 1oz (1.4 mils) each layer
	Via plating thickness: 25 μm
	Surface finish: Immersion Gold (ENIG)
	Top Silkscreen: White
	Bottom Silkscreen: White
	Top Solder Mask: Red
	Bottom Solder Mask: Red
	Top 6 mil / 7 mils trace and gap with 50 ohm differential impdeance controlled.
	100% Electrical test used prior to shipment
5. PCB Statistics	Components: 29
	Total Pads: 87
	Thru Hole Pads: 44
	Top SMT Pads: 32
	Bottom SMT Pads: 11
	Vias: 70
	Nets: 5
6. Type of artwork supplied	Gerber RS-274-X
7. Quality standard	IPC-Class-2
8. Availability	Worldwide
9. Some Typical Applications	Cellular Base Station Antennas and Power Amplifiers
	RF Identification Tags
	Automotive Radar and Sensors
	LNB's for Direct Broadcast Satellites

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