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深圳市碧澄电子科技有限公司
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Hybrid Multilayer PCB on 20mil RO4003C and 20mil High Tg FR4

Shipped: 12th-JAN-2024  

1. Hybrid PCB Introduction
A hybrid PCB refers to a type of PCB that combines different materials to achieve specific functionalities or performance characteristics. In a hybrid PCB, various materials may be used in different sections of the board to meet specific requirements. For example, high-frequency sections may utilize specialized materials like ceramic or Teflon for improved signal integrity, while other sections may use standard FR-4 material.

2. Features (Tg170 FR-4 and 20mil RO4003C Combined)
The combination of Tg170 FR-4 and 20mil RO4003C in a hybrid PCB offers several features and benefits:

- Mixed-signal compatibility:
The hybrid PCB can accommodate both analog and digital signals. The FR-4 portion provides a suitable substrate for standard circuitry, while the RO4003C portion ensures excellent high-frequency performance for RF/microwave signals.
- High-frequency performance:
The RO4003C material has low dielectric loss and excellent signal integrity properties, making it ideal for high-frequency applications. It allows for efficient signal transmission and minimizes signal loss or distortion.
- Thermal management:
The FR-4 material in the hybrid PCB offers good thermal conductivity, assisting in the dissipation of heat generated by components. This can be beneficial for applications that require effective heat management.
- Design flexibility:
Hybrid PCBs allow for the integration of different technologies and materials, enabling greater design flexibility. Designers can optimize the layout and material selection based on the specific requirements of each section of the PCB.
- Cost optimization:
By selectively using RO4003C in sections that require high-frequency performance, costs can be optimized. FR-4 is a more cost-effective and widely available material, making the hybrid PCB economical compared to using high-frequency materials throughout the entire board.
- Compatibility:
Both Tg170 FR-4 and RO4003C are compatible with standard PCB fabrication processes, ensuring ease of manufacturing and assembly.
3. PCB Stackup: 6-layer rigid PCB
Copper_layer_1 - 35 μm
RO4003C - 0.508 mm (20mil)
Copper_layer_2 - 35 μm
Prepreg - 0.102mm
Copper_layer_3 - 35 μm
Tg170°C FR-4 - 0.254mm
Copper_layer_4 - 35 μm
PrePreg - 0.102mm
Copper_layer_5 - 35 μm
Tg170°C FR-4 - 0.508mm
Copper_layer_6 - 35 μm
4. PCB Construction details:
- Board dimensions: 356mm x 373 mm=3Types = 3PCS, +/- 0.15mm
- Minimum Trace/Space: 4/4 mils
- Minimum Hole Size: 0.35mm
- No Blind vias.
- Finished board thickness: 1.8mm
- Finished Cu weight: 1oz (1.4 mils) outer layers
- Via plating thickness: 20 μm
- Surface finish: HASL
- Top Silkscreen: White
- Bottom Silkscreen: No
- Top Solder Mask: Blue
- Bottom Solder Mask: Blue
- 100% Electrical test used prior to shipment
5. PCB Statistics:
Components: 127
Total Pads: 413
Thru Hole Pads: 216
Top SMT Pads: 197
Bottom SMT Pads: 0
Vias: 175
Nets: 12
6. Type of artwork supplied: Gerber RS-274-X
7. Quality standard: IPC-Class-2
8. Availability: worldwide
9. Some Typical Applications:
- Telecommunications
- Radar systems, satellite communications, avionics
- Vehicle communication modules
- Patient monitoring systems
- Industrial automation systems
- Spectrum analyzers, network analyzers, and signal generators
  PCBBACK TO JANUARY
 

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