Shenzhen Bicheng Electronics Technology Co., Ltd
深圳市碧澄电子科技有限公司
+86-755-27374946
info@bicheng-enterprise.com
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F4BTMS350 High Frequency PCB 2-Layer 6.35mm Thickness

Shipped: 8th-JAN-2024  

1. F4BTMS Introduction
The F4BTMS series is an upgraded version of the F4BTM series. It has achieved a technological breakthrough in material formulation and manufacturing processes. The material has been enriched with a significant amount of ceramics and reinforced with ultra-thin and ultra-fine glass fiber cloth, resulting in substantial improvements in material performance and a broader range of dielectric constants. It is a high-reliability material suitable for aerospace applications and can replace similar foreign products.

By incorporating a small amount of ultra-thin and ultra-fine glass fiber cloth and a large amount of uniformly distributed special nano-ceramics mixed with polytetrafluoroethylene resin, the negative effects of glass fiber on electromagnetic wave propagation are minimized. This reduces dielectric loss, enhances dimensional stability, and decreases the X/Y/Z anisotropy of the material. It also increases the usable frequency range, improves electrical strength, and enhances thermal conductivity. Additionally, the material exhibits excellent low thermal expansion coefficient and stable dielectric temperature characteristics.

The F4BTMS series comes with RTF low roughness copper foil as a standard feature, which reduces conductor loss and provides excellent peel strength. It can be used with either copper or aluminum bases.
2. Features (F4BTMS350)
- Dielectric constant (Dk) of 3.5 at 10GHz
- Dissipation factor of .0016 at 10GHz, 0.0019 at 20GHz, 0.0024 at 20GHz
- CTE x-axis of 10 ppm/°C, CTE y-axis of 12 ppm/°C, CTE z-axis of 20 ppm/°C, -55°C to 288°C
- Low thermal coefficient of Dk at-39 ppm/°C, -55°C to 150°C
- High Thermal conductivity of 0.6 W/mk
- Moisture absorption of 0.03%
4. PCB Stackup: 2-layer rigid PCB
Copper_layer_1 - 35 μm
F4BTMS350 Core - 6.35 mm (250mil)
Copper_layer_2 - 35 μm
5. PCB Construction details:
- Board dimensions: 76mm x 76 mm=1PCS, +/- 0.15mm
- Minimum Trace/Space: 6/7 mils
- Minimum Hole Size: 1.5mm
- No Blind vias.
- Finished board thickness: 6.42mm
- Finished Cu weight: 1oz (1.4 mils) outer layers
- Via plating thickness: 20 μm
- Surface finish: Hot Air Soldering Level (HASL)
- Top Silkscreen: No
- Bottom Silkscreen: No
- Top Solder Mask: No
- Bottom Solder Mask: No
- 100% Electrical test used prior to shipment
6. PCB Statistics:
Components: 22
Total Pads: 25
Thru Hole Pads: 14
Top SMT Pads: 11
Bottom SMT Pads: 0
Vias: 27
Nets: 2
7. Type of artwork supplied: Gerber RS-274-X
8. Quality standard: IPC-Class-2
9. Availability: worldwide
10. Some Typical Applications:
- Aerospace equipment, space and cabin equipment
- Microwave, RF
- Radar, military radar
- Feed networks
- Phase-sensitive antennas, phased array antennas
- Satellite communications, and more.
 
 
 
 
 
 
 
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