Shenzhen Bicheng Electronics Technology Co., Ltd
深圳市碧澄电子科技有限公司
+86-755-27374946
info@bicheng-enterprise.com
WELCOME TO BICHENG

 

 

 

 

F4BTME300 High Frequency PCB 2-Layer 3.0mm Thickness

Shipped: 3rd-JAN-2024  

1. F4BTME Introduction
The F4BTME series laminates are manufactured through a meticulous process that involves the scientific formulation of glass fiber cloth, nano-ceramic fillers, and polytetrafluoroethylene (PTFE) resin.

These substrates are built upon the F4BM dielectric layer and incorporate high dielectric constant and low loss nano-ceramics. This integration results in enhanced dielectric constant, superior heat resistance, reduced thermal expansion coefficient, increased insulation resistance, and improved thermal conductivity, all while maintaining low loss characteristics.
Furthermore, F4BTME laminates are specifically paired with reverse-treated RTF copper foil, providing exceptional performance in terms of PIM, precise line control, and minimized conductor loss.
2. Features （F4BTME300)
- Dielectric constant (Dk) of 3.5 at 10GHz
- Dissipation factor of .0018 at 10GHz, 0.0023 at 20GHz
- CTE x-axis of 15 ppm/°C, CTE y-axis of 16 ppm/°C, CTE z-axis of 78 ppm/°C, -55°C to 288°C
- Low thermal coefficient of Dk at-75 ppm/°C, -55°C to 150°C
- PIM value <-160 dbc
- Moisture absorption of 0.05%
4. PCB Stackup: 2-layer rigid PCB
Copper_layer_1 - 35 μm
F4BTME300 Core - 3.0 mm (118mil)
Copper_layer_2 - 35 μm
5. PCB Construction details:
- Board dimensions: 170mm x 95 mm=1PCS, +/- 0.15mm
- Minimum Trace/Space: 7/7 mils
- Minimum Hole Size: 0.4mm
- No Blind vias.
- Finished board thickness: 3.1mm
- Finished Cu weight: 1oz (1.4 mils) outer layers
- Via plating thickness: 20 μm
- Surface finish: Immersion silver
- Top Silkscreen: White
- Bottom Silkscreen: No
- Top Solder Mask: Black
- Bottom Solder Mask: No
- 100% Electrical test used prior to shipment
6. PCB Statistics:
Components: 31
Total Pads: 68
Thru Hole Pads: 43
Top SMT Pads: 25
Bottom SMT Pads: 0
Vias: 39
Nets: 4
7. Type of artwork supplied: Gerber RS-274-X
8. Quality standard: IPC-Class-2
9. Availability: worldwide
10. Some Typical Applications:
- Aerospace equipment, space and cabin equipment
- Microwave, RF
- Radar, military radar
- Feed networks
- Phase-sensitive antennas, phased array antennas
- Satellite communications, and more.
 
 
 
 
  PCBBACK TO JANUARY
　

Copyright  © Shenzhen Bicheng Electronics Technology Co., Ltd. All rights reserved

Tags Printed Circuit Board, High Frequency PCB, RF PCB, Microwave PCB, Rogers PCB, Rogers RO3003, RO3003G2, RO3010, RO3006, RO3035, RO3203, RO3206, RO3210, Rogers RO4003C, RO4350B, RO4360G2, RO4725JXR, RO4730G3, RO4533, RO4534, RO4535, RO4830, RO4835, RT/duroid 5880, RT/duroid 5870, RT/duroid 6002, RT/duroid 6010, RT/duroid 6035HTC, Rogers TMM3, TMM4, TMM6, TMM10, TMM10i, TMM13i, Rogers Kappa438, CLTE-XT, AD250C, AD255C, AD300D, AD350A, AD450, AD600, AD1000, TC350, TC600, DiClad 880, DiClad 870, DiClad 527, IsoClad 917; Taconic PCB, TLF-35, RF-35TC, RF-60A, RF-60TC, RF-35A2, RF-35, RF-45, RF-10, TRF-45, TLX-0, TLX-9, TLX-8, TLX-7, TLX-6, TLY-3, TLY-5, TLY-5Z, TSM-DS3, PTFE PCB, Wangling RF PCB, F4BM220, F4BME220, F4BTM220, F4BTME220, F4BTMS220