Shenzhen Bicheng Electronics Technology Co., Ltd
深圳市碧澄电子科技有限公司
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info@bicheng-enterprise.com
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F4BTM450 3.2mm High Frequency PCB

Shipped: 8th-FEB-2024  

1. F4BTM Introduction
F4BTM is a series of high-frequency circuit laminates composed of glass fiber cloth, nano-ceramic filling, and polytetrafluoroethylene resin. It undergoes a scientific preparation and strict process pressing.

This product series is based on the F4BM dielectric layer and incorporates high-dielectric and low-loss nanoscale ceramics. As a result, it achieves a higher dielectric constant, improved heat resistance, reduced coefficient of thermal expansion, enhanced insulation resistance, and better thermal conductivity. These improvements are achieved while maintaining the low-loss characteristics of the material.

F4BTM is paired with forward rotating ED copper foils, making it suitable for applications where PIM (Passive Intermodulation) indicators are not a concern.
2. Features (F4BTM450) - Dielectric constant (Dk) of 4.5 at 10GHz - Dissipation factor of .002 at 10GHz - CTE x-axis of 10 ppm/°C, CTE y-axis of 12 ppm/°C, CTE z-axis of 51 ppm/°C, -55°C to 288°C - Low thermal coefficient of Dk at-60 ppm/°C, -55°C to 150°C - Moisture absorption of 0.05%
4. PCB Stackup: 2-layer rigid PCB Copper_layer_1 - 35 μm F4BTM450 Core - 3.05 mm (120mil) Copper_layer_2 - 35 μm
5. PCB Construction details: - Board dimensions: 63mm x 63 mm=1PCS, +/- 0.15mm - Minimum Trace/Space: 6/8 mils - Minimum Hole Size: 0.4mm - No Blind vias. - Finished board thickness: 3.1mm - Finished Cu weight: 1oz (1.4 mils) outer layers - Via plating thickness: 20 μm - Surface finish: Immersion Gold - Top Silkscreen: White - Bottom Silkscreen: No - Top Solder Mask: Black - Bottom Solder Mask: No - 100% Electrical test used prior to shipment
6. PCB Statistics: Components: 31 Total Pads: 59 Thru Hole Pads: 32 Top SMT Pads: 27 Bottom SMT Pads: 0 Vias: 28 Nets: 3
7. Type of artwork supplied: Gerber RS-274-X
8. Quality standard: IPC-Class-2
9. Availability: worldwide
 
10. Some Typical Applications: - Aerospace equipment, space and cabin equipment - Microwave, RF - Radar, military radar - Feed networks - Phase-sensitive antennas, phased array antennas - Satellite communications
 
 
 
 
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