F4BME217 PCB Supplier

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F4BME217 PCB 2-layer 10mil

Shipped: 17th-September-2024

1. Introduction of F4BME material
These series laminates are made by scientifically formulating and strictly pressing a combination of fiberglass cloth, polytetrafluoroethylene resin, and polytetrafluoroethylene film. Its electrical performance is improved compared to F4B, mainly due to a wider range of dielectric constants, lower dielectric loss, increased insulation resistance, and improved stability. It can replace similar foreign products.

F4BME and F4BM have the same dielectric layer but different copper foil combinations: F4BME is paired with reverse-treated foil (RTF) copper foil, offering excellent PIM performance, more precise line control, and lower conductor loss. F4BM is paired with ED copper foil, suitable for applications without PIM requirements.

By adjusting the ratio between polytetrafluoroethylene and fiberglass cloth, F4BM and F4BME achieve precise control of the dielectric constant, providing low loss and enhanced dimensional stability. A higher dielectric constant corresponds to a higher proportion of fiberglass, resulting in better dimensional stability, lower thermal expansion coefficient, improved temperature drift, and a slight increase in dielectric loss.

2. Features
-DK options available: 2.17 to 3.0, customizable DK
-Low loss
-F4BME paired with RTF copper foil, excellent PIM performance
-Diverse sizes, cost-effective
-Radiation resistance, low outgassing
-Commercialized, large-scale production, high cost-effectiveness

3. Model Numbers
F4BME217 (DK2.17)
F4BME220 (DK2.2)
F4BME233 (DK2.33)
F4BME245 (DK2.45)
F4BME255 (DK2.55)
F4BME265 (DK2.65)
F4BME275 (DK2.75)
F4BME294 (DK2.94)
F4BME300 (DK3.0)

4. PCB Stackup: 2-layer rigid PCB
Copper_layer_1 - 35 μm
Rogers F4BME217 Core - 0.254 mm
Copper_layer_2 - 35 μm

5. PCB Construction details:
- Board dimensions: 31.6 mm x 31.6 mm=1PCS, +/- 0.15mm
- Minimum Trace/Space: 5/4 mils
- Minimum Hole Size: 0.3mm
- No Blind vias.
- Finished board thickness: 0.3mm
- Finished Cu weight: 1oz (1.4 mils) outer layers
- Via plating thickness: 20 μm
- Surface finish: Immersion Tin
- Top Silkscreen: No
- Bottom Silkscreen: No
- Top Solder Mask: No
- Bottom Solder Mask: No
- Controlled depth slots requried
- 100% Electrical test used prior to shipment

6. PCB Statistics:
Components: 14
Total Pads: 20
Thru Hole Pads: 12
Top SMT Pads: 8
Bottom SMT Pads: 0
Vias: 16
Nets: 2

7. Type of artwork supplied: Gerber RS-274-X

8. Quality standard: IPC-Class-2

9. Availability: worldwide

10. Some Typical Applications:
- Microwave, RF, and radar systems
- Phase shifters, passive components
- Power dividers, couplers, combiners, feed networks
- Phased array antennas, satellite communications
- Base station antennas

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