Shenzhen Bicheng Electronics Technology Co., Ltd
深圳市碧澄电子科技有限公司
+86-755-27374946
info@bicheng-enterprise.com
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3mm F4BM265 2layer RF PCB

Shipped: 12th-April-2024  

1. Introduction of F4BM265
Wangling's F4BM265 laminates are made by scientifically formulating and strictly pressing a combination of fiberglass cloth, polytetrafluoroethylene resin, and polytetrafluoroethylene film. Its electrical performance is improved compared to F4B265, mainly due to lower dielectric loss, increased insulation resistance, and improved stability. It can replace similar foreign products.

F4BM265 and F4BME265 have the same dielectric layer but different copper foil combinations: F4BM265 is paired with ED copper foil, suitable for applications without PIM requirements; F4BME265 is paired with reverse-treated foil (RTF) copper foil, offering excellent PIM performance, more precise line control, and lower conductor loss.
By adjusting the ratio between polytetrafluoroethylene and fiberglass cloth, F4BM265 and F4BME265 achieve precise control of the dielectric constant, providing low loss and enhanced dimensional stability. A higher dielectric constant corresponds to a higher proportion of fiberglass, resulting in better dimensional stability, lower thermal expansion coefficient, improved temperature drift, and a slight increase in dielectric loss.
2. Features （F4BM265)
- Dielectric constant (Dk) of 2.65 at 10GHz
- Dissipation factor of .0013 at 10GHz
- CTE x-axis of 14 ppm/°C, CTE y-axis of 17 ppm/°C, CTE z-axis of 142 ppm/°C, -55°C to 288°C
- Low thermal coefficient of Dk at-100 ppm/°C, -55°C to 150°C
- Moisture absorption of ≤0.08%
- Flammability of UL-94 V0
3. PCB Stackup: 2-layer rigid PCB
Copper_layer_1 - 70 μm
F4BM265 Core - 3.00 mm (118mil)
Copper_layer_2 - 70 μm
4. PCB Construction details:
- Board dimensions: 45.33mm x 50.2 mm=1PCS, +/- 0.15mm
- Minimum Trace/Space: 5/5 mils
- Minimum Hole Size: 0.5mm
- No Blind vias.
- Finished board thickness: 3.1mm
- Finished Cu weight: 1oz (1.4 mils) outer layers
- Via plating thickness: 20 μm
- Surface finish: HASL Lead free
- Top Silkscreen: White
- Bottom Silkscreen: No
- Top Solder Mask: Black
- Bottom Solder Mask: No
- 100% Electrical test used prior to shipment
5. PCB Statistics:
Components: 12
Total Pads: 37
Thru Hole Pads: 21
Top SMT Pads: 16
Bottom SMT Pads: 0
Vias: 25
Nets: 2
6. Type of artwork supplied: Gerber RS-274-X
7. Quality standard: IPC-Class-2
8. Availability: worldwide
9. Some Typical Applications:
- Microwave, RF, and radar systems
- Phase shifters
- Power dividers, couplers, combiners
- Feed networks
- Phase-sensitive antennas, phased array antennas
- Satellite communications
- Base station antennas
 
 
 
 
 
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