Shenzhen Bicheng Electronics Technology Co., Ltd
深圳市碧澄电子科技有限公司
+86-755-27374946
info@bicheng-enterprise.com
WELCOME TO BICHENG

 

 

 

 

F4BM250 High Frequency PCB Built on 30 mil 0.762mm Laminates


Shipped:31st-Oct-2023  

We are pleasure to announce the arrival of our latest shipment of F4BM250 High Frequency PCB! This cutting-edge PCB is designed to meet the demands of high-frequency applications, delivering exceptional performance and reliability. We are excited to introduce this advanced PCB to you.

Substrates Profile
Wangling F4BM250 PTFE Fiberglass Positive ED copper foil is a high-quality PCB substrate offering excellent performance. With a dielectric constant of 2.50 at 10 GHz/23°C and a low loss tangent of 0.0012 at 10 GHz, this substrate ensures reliable signal transmission. It boasts a peel strength greater than 1.8 N/mm, ensuring strong adhesion between layers. With a moisture absorption rate of less than 0.08%, it exhibits excellent resistance to moisture. The CTE values of 20 ppm/°C (X-axis), 25 ppm/°C (Y-axis), and 187 ppm/°C (Z-axis) provide stability and dimensional control.

Substrates Features
The F4BM250?substrates offer a range of dielectric thicknesses, allowing flexibility in design. Their diverse sizes contribute to cost-saving opportunities, making them suitable for various applications. These substrates are commercially available, produced on a large scale, and offer high cost-effectiveness.

PCB Stackup: 2-layer rigid PCB
The stackup for the F4B PCB consists of:

Copper_layer_1: 35 μm
F4BM250: 0.762 mm (30mil)
Copper_layer_2: 35 μm

PCB Construction details
The construction details of the F4B PCB are as follows:

Board dimensions: 96.15mm x 58.4 mm (1PCS), +/- 0.15mm tolerance
Minimum Trace/Space: 6/5 mils
Minimum Hole Size: 0.4mm
No Blind vias
Finished board thickness: 0.8mm
Finished Cu weight: 1oz (1.4 mils) outer layers
Via plating thickness: 20 μm
Surface finish: Bare copper (no surface finish)
Top Silkscreen: No
Bottom Silkscreen: No
Top Solder Mask: No
Bottom Solder Mask: No
100% Electrical test used prior to shipment

PCB Statistics
The F4B PCB features the following statistics:

Components: 35
Total Pads: 80
Thru Hole Pads: 38
Top SMT Pads: 42
Bottom SMT Pads: 0
Vias: 63
Nets: 7

Artwork and Standards
The artwork supplied for the F4BM250 PCB is in Gerber RS-274-X format. It adheres to the IPC-Class-2 standard, ensuring high quality and reliability.

Availability and Applications
The F4B PCB substrates are available to worldwide and find applications in various fields, including:

Microwave, RF, Radar
Phase shifter, passive device
Power divider, coupler, combiner
Feed network, phased array antenna
Satellite communication, base station antenna

 

Parameter

Value

PCB Substrates

Wangling F4BM250 PTFE Fiberglass Positive ED copper foil

Dielectric constant at 10 GHz/23°C

2.5

Loss tangent at 10 GHz

0.0012

Peel strength

>1.8 N/mm

Moisture Absorption

<0.08%

CTE (X-axis)

20 ppm/°C

CTE (Y-axis)

25 ppm/°C

CTE (Z-axis)

187 ppm/°C

Features

Variety of dielectric thicknesses

Diverse sizes lead to cost-saving

Commercialized, large-scale production, high cost-effectiveness

Stackup

2-layer rigid PCB

Copper_layer_1

35 μm

F4BM250

0.762 mm (30mil)

Copper_layer_2

35 μm

Construction details

Board dimensions

96.15mm x 58.4 mm (1PCS), +/- 0.15mm tolerance

Minimum Trace/Space

6/5 mils

Minimum Hole Size

0.4mm

Blind vias

No

Finished board thickness

0.8mm

Finished Cu weight

1oz (1.4 mils) outer layers

Via plating thickness

20 μm

Surface finish

Bare copper (no surface finish)

Top Silkscreen

No

Bottom Silkscreen

No

Top Solder Mask

No

Bottom Solder Mask

No

Electrical test

100% Electrical test used prior to shipment

PCB Statistics

Components

35

Total Pads

80

Thru Hole Pads

38

Top SMT Pads

42

Bottom SMT Pads

0

Vias

63

Nets

7

Type of artwork supplied

Gerber RS-274-X

Accepted standard

IPC-Class-2

Availability

Worldwide

Some Typical Applications

Microwave, RF, Radar

Phase shifter, passive device

Power divider, coupler, combiner

Feed network, phased array antenna

Satellite communication, base station antenna

 
 
  PCBBACK TO OCTOBER
 
 
 

Copyright  © Shenzhen Bicheng Electronics Technology Co., Ltd. All rights reserved

Tags Printed Circuit Board, High Frequency PCB, RF PCB, Microwave PCB, Rogers PCB, Rogers RO3003, RO3010, RO3006, RO3035, RO3203, RO3210, Rogers RO4003C, RO4350B, RO4360G2, RO4730G3, RO4533, RO4534, RO4535, RO4835, RT/duroid 5880, RT/duroid 5870, RT/duroid 6002, RT/duroid 6010, RT/duroid 6035HTC, Rogers TMM3, TMM4, TMM6, TMM10, TMM10i, TMM13i, Rogers Kappa438, Taconic PCB, TLF-35, RF-35TC, RF-60A, RF-60TC, RF-35A2, RF-35, RF-45, RF-10, TRF-45, TLX-0, TLX-9, TLX-8, TLX-7, TLX-6, TLY-3, TLY-5, TLY-5Z, , PTFE PCB, F4B RF PCB, AD250C, AD255C, AD300D, AD350A, AD450, AD600, AD1000, TC350, TC600, DiClad 880, DiClad 870, DiClad 527, IsoClad 917