DiClad 870 PCB 2-layer 20mil

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DiClad 870 2-layer 20mil RF PCB

Shipped: 13th-April-2024

1. Introduction of DiClad 870
Rogers DiClad 870 laminates are woven fiberglass reinforced, PTFE-based composites that offer lower dielectric constant for use as printed circuit board substrates. By using fewer plies of woven fiberglass and a higher ratio of PTFE content, the DiClad 870 laminates offer lower dielectric constants (Dk) and dissipation factors at a similar thickness to other laminates in the DiClad? series.

2. Features
- DK of 2.33 at 10 GHz and 1 MHz, 50% RH
- Dissipation factor of 0.0013 at 10 GHz, 0.0009 at 1MHz, 50% RH
- TcDK of -161 ppm/°C ranging -10~140°C, 10 GHz
- Arc Resistance >180 seconds
- Moisture Absorption 0.02%
- CTE in X-axis of 17 ppm/°C, Y-axis of 29ppm/°C and Z-axix of 217ppm/°C
- Copper Peel Strength of 14 lbs/in, 10s @288?C
- Flammability of UL 94V0 grade

3. Benefits
- Lowest moisture absorption among PTFE based composites
- Stable Dk over a wide frequency range
- Low Dk supports wider line widths for lower insertion loss

4. PCB Stackup: 2-layer rigid PCB
Copper_layer_1 - 35 μm
DiClad 870 - 0.508 mm (20mil)
Copper_layer_2 - 35 μm

5. PCB Construction details:
- Board dimensions: 66.2mm x 66.2mm=1PCS, +/- 0.15mm
- Minimum Trace/Space: 5/4 mils
- Minimum Hole Size: 0.4mm
- No Blind vias.
- Finished board thickness: 0.6mm
- Finished Cu weight: 1oz (1.4 mils) outer layers
- Via plating thickness: 20 μm
- Surface finish: Immersion Silver
- Top Silkscreen: No
- Bottom Silkscreen: No
- Top Solder Mask: No
- Bottom Solder Mask: No
- 100% Electrical test used prior to shipment

6. PCB Statistics:
Components: 16
Total Pads: 40
Thru Hole Pads: 26
Top SMT Pads: 14
Bottom SMT Pads: 0
Vias: 15
Nets: 2

7. Type of artwork supplied: Gerber RS-274-X

8. Accepted standard: IPC-Class-2

9. Availability: worldwide

10. Some Typical Applications:
- Radar Feed Networks
- Commercial Phased Array Networks
- Low Loss Base Station Antennas
- Guidance Systems
- Digital Radio Antennas
- Filters, Couplers, LNAs

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