Shenzhen Bicheng Electronics Technology Co., Ltd
深圳市碧澄电子科技有限公司
+86-755-27374946
info@bicheng-enterprise.com
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CLTE-XT High Frequency PCB 2-layer 30mil

Shipped: 7th-MAR-2024  

1. Introducition of CLTE-XT
Rogers CLTE-XT laminates are composites of micro-dispersed ceramic filler, PTFE and woven fiberglass reinforcement, designed to improve loss tangent while providing the lowest insertion loss and highest degree of dimensional stability in its class. Building on the reliability of the CLTE laminates, CLTE-XT maintains its properties over an even wider temperature range.

 
2. Features
- Dielectric Constant of DK 2.79 to 2.94 by thcikness at 10GHz, 23°C @ 50% RH
- Dissipation Factor of 0.0010 at 10GHz, 23°C @ 50% RH
- X axis CTE of 12.7ppm/°C, Y CTE of 13.7ppm/°C, Z CTE of 40.8ppm/°C
- Td 539 °C
- Thermal Coefficient of Dielectric Constant of -8ppm/?C
- Tightest dielectric constant tolerance in the CLTE family (+/- .03)
- Low Moisture Absorption of 0.02%
3. Benefits:
- High plated through hole reliability
- Repeatable lot-to-lot performance
- Reduced circuit losses without sacrificing dimensional stability
- Dielectric constant stability with temperature change leading to Reduced stress attachment to ceramic active devices
 
4. PCB Stackup: 2-layer rigid PCB
Copper_layer_1 - 35 μm
Rogers CLTE-XT Core - 0.762 mm (30mil)
Copper_layer_2 - 35 μm
5. PCB Construction details:
- Board dimensions: 42.91mm x 108.31 mm=1PCS, +/- 0.15mm
- Minimum Trace/Space: 5/7 mils
- Minimum Hole Size: 0.3mm
- No Blind vias.
- Finished board thickness: 0.8mm
- Finished Cu weight: 1oz (1.4 mils) outer layers
- Via plating thickness: 20 μm
- Surface finish: Immersion Tin
- Top Silkscreen: Black
- Bottom Silkscreen: No
- Top Solder Mask: No
- Bottom Solder Mask: No
- 100% Electrical test used prior to shipment
 
6. PCB Statistics:
Components: 21
Total Pads: 68
Thru Hole Pads: 41
Top SMT Pads: 27
Bottom SMT Pads: 0
Vias: 65
Nets: 3
7. Type of artwork supplied: Gerber RS-274-X
 
8. Quality standard: IPC-Class-2
9. Availability: worldwide
10. Some Typical Applications:
- Advanced Driver Assistance Systems (ADAS)
- Patch Antennas
- Phased Array Antennas
- Power Amplifiers
- Ground-based and airborne communications and radar systems.
 
 
  PCBBACK TO MARCH
　

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