Shenzhen Bicheng Electronics Technology Co., Ltd
深圳市碧澄电子科技有限公司
+86-755-27374946
info@bicheng-enterprise.com
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AD1000 High Frequency PCB 2-layer 50mil

Shipped: 6th-MAR-2024  

1. Introduction of AD1000
AD1000 is woven-glass reinforced laminate allowing for greater dimensional stability and mechanical robustness than other 10 Dk Products. Its large panel size is also advantageous for“multi-circuitsperpanel”processing. Its high dielectric constant substrate permits circuit miniaturization, compared to traditional low loss materials. It is especially beneficial for power amplifiers, filters, couplers, and other components using low-impedance lines.

 
AD1000 laminate is considered a “soft substrate” and is relatively insensitive to vibrational stress. This allows miniaturized circuitry without requiring the complicated processing or special handling associated with brittle pure ceramic or ceramic hydrocarbon materials.
 
2. Features
- Only Woven Glass Reinforced PTFE/Ceramic with Dk of 10.2 or greater
- ThermalConductivity is “Best-in-Class”
- High copper peel strength of >12 lbs/in (after thermal stress), 13.6 lbs/in (at elevated temperatures (150oC) ), allows for thinner etched line widths
- Lowest Insertion Loss Available
- Larger Panel Sizes Available
- Low Moisture Absorption of 0.03%
- Excellent CTE Values of 8 ppm/oC, 10 ppm/oC and 20 ppm/oC in X,Y,Z direction, lead to highly reliability ceramic component attachment and PTH reliability
3. Benefits
- Mechanically Robust
- Greater Dimensional Stability than Other 10 Dk Products
- Circuit Miniaturization Leadsto Weight Savings
- Heat Dissipation and Management
- Greater Signal Integrity
- Cost-Effective Board Layout and Board Processing
- Low Loss in Humid Environments
 
4. PCB Stackup: 2-layer rigid PCB
Copper_layer_1 - 35 μm
AD1000 Core- 1.527 mm (50mil)
Copper_layer_2 - 35 μm
5. PCB Construction details:
- Board dimensions: 42.6mm x 21.5 mm=1PCS, +/- 0.15mm
- Minimum Trace/Space: 4/4 mils
- Minimum Hole Size: 0.32mm
- No Blind vias.
- Finished board thickness: 1.6mm
- Finished Cu weight: 1 oz (1.4 mils) outer layers
- Via plating thickness: 20 μm
- Surface finish: Immersion Gold
- Top Silkscreen: No
- Bottom Silkscreen: No
- Top Solder Mask: No
- Bottom Solder Mask: No
- 100% Electrical test used prior to shipment
 
6. PCB Statistics:
Components: 3
Total Pads: 11
Thru Hole Pads: 7
Top SMT Pads: 4
Bottom SMT Pads: 0
Vias: 4
Nets: 1
 
7. Type of artwork supplied: Gerber RS-274-X
8. Accepted standard: IPC-Class-2
9. Availability: worldwide
10. Typical Applications
- Idealfor X-Band and Below
- Radar Modules and Manifolds
- Aircraft Collision Avoidance Systems (TCAS)
- Ground Based Radar Surveillance Systems
- Miniaturized Circuitry&Patch Antennas
- Power Amplifiers(PAs)
- Low Noise Amplifiers(LNAs)
 
  PCBBACK TO MARCH
　

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