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6-Layer Rigid-flex circuits 1.0mm Thick PCB

Shipped: 5th-FEB-2024

1. Introduction of Rigid-flex Cirucits A rigid-flex circuit is a combination of rigid boards and flexible circuits. The rigid boards provide structural support and house electronic components, while the flexible circuits offer flexibility and allow for bending or folding of the circuit.

The manufacturing process of a rigid-flex circuit involves creating the flexible circuit separately from the rigid boards. The flexible circuit is typically made using a flexible substrate, such as polyimide, and features conductive traces and pads. The rigid boards, made of materials like FR4, are manufactured separately as well.

The flexible circuit is manufactured separately and then bonded to the rigid boards. This bonding can be done symmetrically, where the flexible circuit is placed in the middle of the rigid boards, or asymmetrically, where it is attached to the outer side of the rigid boards to enable interconnection.

To establish electrical connections between the flexible circuit section (interconnect) and the electronic circuits on the rigid boards, plated-through holes are incorporated in the rigid sections of the rigid-flex circuits. These holes facilitate the flow of electrical current. The manufacturing processes involved in creating these plated-through holes are similar to those used in producing rigid multilayer boards.

2. Features of S1000-2M (FR-4) - Lead-free compatible FR-4.0 laminate - Tg180℃ (DSC), UV Blocking/AOI compatible - High heat resistance - Lower Z-axis CTE - Excellent through-hole reliability - Excellent Anti-CAF performance - Low water absorption - Excellent mechanical processability

3. Features of R-F777 (Polyimide) - Polyimide (PI) thickness ranging 25um, 50um and 75um - Copper types with ED copper and RA copper, thickness ranging 12um, 18um, and 35um - Coefficient of Thermal Expansion (CTE) ranging 18.5-19.7 ppm/K - High Tg value of 350℃ - Soldering Resistance of 280-350℃ - Flammability of UL 94V-0

4. PCB Stackup: 6-layer rigid-flex PCB (4-layer flex with air gap) Copper_layer_1 - 35 μm S1000-2M Rigid - 0.565 mm (22.2mil) SF-PC6000 Adhesive (66μm) Copper_layer_2 (inner layer) - 18 μm R-F777 0.075mm (75μm) Copper_layer_3 (inner layer) - 18 μm SF-PC6000 Adhesive (66μm) Copper_layer_4 (inner layer) - 18 μm R-F777 0.075mm (75μm) Copper_layer_5 (inner layer) - 18 μm SF-PC6000 Adhesive (66μm) S1000-2M Rigid - 0.565mm (22.2mil) Copper_layer_6 - 35 μm

5. PCB Construction details: - Board dimensions: 112mm x 54 mm=1PCS, +/- 0.15mm - Minimum Trace/Space: 5/5 mils - Minimum Hole Size: 0.50mm - No Blind vias. - Finished board thickness: 1.0mm+/-10%, flex part thickness 0.22mm +/-0.05mm - Finished Cu weight: 1oz (1.4 mils) outer layers - Via plating thickness: 20 μm - Surface finish: Immersion gold - Top Silkscreen: White - Bottom Silkscreen: No - Top Solder Mask: Matt Black - Bottom Solder Mask: Matt Black - 100% Electrical test used prior to shipment

6. PCB Statistics: Components: 25 Total Pads: 103 Thru Hole Pads: 71 Top SMT Pads: 32 Bottom SMT Pads: 0 Vias: 42 Nets: 7

7. Type of artwork supplied: Gerber RS-274-X

8. Accepted standard: IPC-Class-2

9. Availability: worldwide

10. Some Typical Applications:- computer, communication, automotive electronics, and etc.

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