1. Introduction of TC600
TC600 woven fiberglass reinforced, ceramic filled, PTFE-based composite for use as a printed circuit board substrate is designed to provide enhanced heat-transfer through “Best-In-Class” thermal conductivity, while reducing dielectric loss and insertion loss. Lower losses result in higher Amplifier and Antenna Gains/Efficiencies. Mechanical robustness is also greatly improved for the 6.15 dielectric constant market.

The increased thermal conductivity of TC600 laminate provides higher power handling, reduces hot-spots and improves device reliability. This higher heat transfer within the substrate complements designs using coins, heat sinks or thermal vias to provide designers additional design margin in managing heat. In designs with limited thermal management options, TC600 laminate significantly improves heat transfer where the primary thermal path is through the laminate. This results in reduced in junction temperatures and extends the life of active components, which is critical for improving power amplifier reliability, extending MTBF and reducing warranty costs. In addition, lower operating temperatures and chip-matching thermal expansion characteristics provide better reliability for component attachment prone to solder fatigue, solder softening and joint failure.