Shenzhen Bicheng Electronics Technology Co., Ltd
深圳市碧澄电子科技有限公司
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info@bicheng-enterprise.com
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2mm F4BTMS1000 RF PCB

Shipped: 9th-August-2024  

1. Introduction of F4BTMS material
The F4BTMS series is an upgraded version of the F4BTM series. Building upon its foundation, significant technological advancements have been made in material formulation and manufacturing processes. The material now incorporates a large amount of ceramics and utilizes ultra-thin and ultra-fine fiberglass cloth reinforcement. These enhancements have greatly improved the material's performance, resulting in a wider range of dielectric constants. It is a high-reliability material suitable for aerospace applications, capable of replacing similar foreign products.

By incorporating a small amount of ultra-thin and ultra-fine fiberglass cloth reinforcement, along with a significant and uniform mixture of special nanoceramics and polytetrafluoroethylene resin, the fiberglass effect during the propagation of electromagnetic waves is minimized, reducing dielectric loss and enhancing dimensional stability. The material exhibits reduced anisotropy in the X/Y/Z directions, allowing for higher frequency usage, increased electrical strength, and improved thermal conductivity. The material also possesses excellent low coefficient of thermal expansion and stable dielectric temperature characteristics.

The F4BTMS series comes standard with RTF low roughness copper foil, which not only reduces conductor loss but also provides excellent peel strength. It can be paired with copper-based or aluminum-based options.
2. Features
- Minimal dielectric constant tolerance and excellent batch-to-batch consistency.
- Extremely low dielectric loss.
- Stable dielectric constant and low loss within frequencies up to 40GHz, meeting the requirements of phase-sensitive applications.
- Excellent temperature coefficient of dielectric constant and dielectric loss, maintaining frequency and phase stability between -55°C and 150°C.
- Excellent resistance to radiation, retaining stable dielectric and physical properties even after exposure to irradiation.
- Low outgassing performance, meeting the vacuum outgassing requirements for aerospace applications.
- Minimal thermal expansion coefficients in the X/Y/Z directions, ensuring dimensional stability and reliable hole copper connections.
- Improved thermal conductivity, suitable for high-power applications.
- Excellent dimensional stability.
- Low water absorption.
3. Model Numbers
F4BTMS220 (DK2.2)
F4BTMS233 (DK2.33)
F4BTMS255 (DK2.55)
F4BTMS265 (DK2.65)
F4BTMS294 (DK2.94)
F4BTMS300 (DK3.0)
F4BTMS350 (DK3.5)
F4BTMS430 (DK4.3)
F4BTMS450 (DK4.5)
F4BTMS615 (DK6.15)
F4BTMS1000 (DK10.2)
4. PCB Stackup: 2-layer rigid PCB
Copper_layer_1 - 35 μm
Rogers F4BTMS1000 Core - 2.0 mm
Copper_layer_2 - 35 μm
5. PCB Construction details:
- Board dimensions: 57mm x 57 mm=1PCS, +/- 0.15mm
- Minimum Trace/Space: 6/8 mils
- Minimum Hole Size: 0.4mm
- No Blind vias.
- Finished board thickness: 2.1mm
- Finished Cu weight: 2oz (2.8 mils) outer layers
- Via plating thickness: 20 μm
- Surface finish: Immersion Gold
- Top Silkscreen: No
- Bottom Silkscreen: No
- Top Solder Mask: No
- Bottom Solder Mask: No
- Controlled depth slots requried
- 100% Electrical test used prior to shipment
6. PCB Statistics:
Components: 10
Total Pads: 27
Thru Hole Pads: 18
Top SMT Pads: 9
Bottom SMT Pads: 0
Vias: 17
Nets: 2
7. Type of artwork supplied: Gerber RS-274-X
8. Quality standard: IPC-Class-2
9. Availability: worldwide
10. Some Typical Applications:
- Aerospace and aviation equipment
- Space installations, and cabin setups
- Microwave and RF applications
- Radar systems, particularly in military applications
- Feed networks for signal distribution
- Phase-sensitive antennas and phased array antennas
- Satellite communications
  PCBBACK TO AUGUST
 

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