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RO4003C Rogers Multi-layer PCB 3-layer Board Built on 20mil and 60mil Substrates with ENEPIG Surface Finish

Shipped: 19th-May-2023

We are excited to introduce our high-quality PCB manufactured by Bicheng Limited. This board is designed to meet the highest standards in performance and durability, featuring Rogers RO4003C material with lead-free processing for -40℃ to +85℃ operation.

The stackup consists of base copper weight of 17um, RO4003C 20mil dielectric, RO4450F prepreg, base copper weight of 17um, RO4003C 60mil dielectric, RO4450F prepreg, RO4003C 60mil dielectric, RO4450F prepreg, RO4003C 20mil dielectric, and base copper weight of 17um. This unique stackup delivers excellent thermal dissipation performance and is ideal for high-power applications.

The board dimensions are 90.00 x 90.00 mm, including tooling strips, with a minimum trace/space of 5/5 mils and a minimum hole size of 16 mils. There are no blind or buried vias, and the finished board thickness is 4.8mm with a finished copper weight of 1 oz (1.4 mils) all layers

This PCB features Immersion Nickle Immersion Palladium and Immersion Gold (ENEPIG) surface finish, top and bottom solder mask, and no top or bottom silkscreen. There is no silkscreen on solder pads, and solder paste stencils are supplied for the top sides, making assembly quick and straightforward. Our 100% electrical testing guarantees that our boards meet the highest industry standards.

To ensure better thermal dissipation, minimum vias need to be filled with copper paste. Furthermore, countersunk holes are required to avoid the protrusion of screws and ensure the flatness of the installation surface.

The board has 31 components, 92 pads, 51 thru-hole pads, 15 top SMT pads, 26 bottom SMT pads, 59 vias, and 75 nets. If you have any technical questions or inquiries, please do not hesitate to contact our team at sales@bicheng-enterprise.com. Copyright Bicheng Limited., 2023. All rights reserved.

Specifications	Value
1. PCB Material	Rogers RO4003C
	Lead-free process
	-40℃ to +85℃ operation
2. Stackup	Base copper 17um +
	Dielectric RO4003C 20mil
	Prepreg RO4450F
	Base copper 17um
	Dielectric RO4003C 60mil
	Prepreg RO4450F
	Dielectric RO4003C 60mil
	Prepreg RO4450F
	Dielectric RO4003C 20mil
	Base copper 17um
3. Construction details	Board dimensions: 90.00 x 90.00mm=1 pcs, +/- 0.15mm
	Minimum Trace/Space: 5/5 mils
	Minimum Hole Size: 16 mils
	No blind or buried vias
	Finished board thickness: 4.8mm
	Finished Cu weight: 1 oz (1.4 mils) all layers
	Via plating thickness: 1 mil
	Surface finish: Immersion Nickle Immersion Palladium and Immersion Gold (ENEPIG)
	Top Silkscreen: No
	Bottom Silkscreen: No
	Top Solder Mask: Matt Black
	Bottom Solder Mask: No
	No silkscreen on solder pads
	100% Electrical test used
	Minimum vias need to be filled with copper paste for better thermal dissipation
	Countersunk holes required to avoid the protrusion of screws and ensure the flatness of the installation surface
4. Solder paste stencil	Supplied for Top sides
5. PCB Statistics	Components: 31
	Total Pads: 92
	Thru Hole Pads: 51
	Top SMT Pads: 15
	Bottom SMT Pads: 26
	Vias: 59
	Nets: 75

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