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RO3010 Double Sided, Dual Layer Rogers PCB Built on 25mil Substrates with Immersion Gold

Shipped: 17th-May-2023

We are pleased to Introduce our high-quality RF PCBs which were shipped in May 2023. This PCB features Rogers RO3010 material with lead-free processing for -40℃ to +85℃ operation, making it ideal for high-frequency applications.

The stackup consists of base copper weight of 17um, RO3003 25mil dielectric, and base copper weight of 17um, delivering excellent electrical performance. With a finished board thickness of 0.8mm and a finished copper weight of 1 oz (1.4 mils) all layers, this PCB is built to last.

The board dimensions are 80.00 x 60.00 mm, including tooling strips, with a minimum trace/space of 7/7 mils and a minimum hole size of 15 mils. With 100% electrical testing, you can be confident that our boards meet the highest industry standards.

This PCB features Electroless Nickel and Immersion Gold (ENIG) surface finish, green top solder mask, and white top silkscreen. A solder paste stencil is supplied for the top side, making assembly quick and straightforward.

The board has 19 components, 38 pads, 21 thru-hole pads, 17 top SMT pads, 0 bottom SMT pads, 35 vias, and 15 nets. Though impedance matching is not included, a +/- 10% tolerance can be achieved.

At Bicheng Limited, we take pride in providing high-quality PCBs tailored to your specific needs. For any technical questions or inquiries, please do not hesitate to contact our team at sales@bicheng-enterprise.com. Copyright Bicheng Limited., 2023. All rights reserved

Specifications	Value
1. PCB Material	Rogers RO3010
	Lead-free process
	-40℃ to +85℃ operation
2. Stackup	Base copper 17um
	RO3003 25mil dielectric
	Base copper 17um
3. Construction details	Board dimensions: 80.00 x 60.00mm=1 PCS (including tooling strips), +/- 0.15mm
	Minimum Trace/Space: 7/7 mils
	Minimum Hole Size: 15 mils
	No blind or buried vias
	Finished board thickness: 0.8mm
	Finished Cu weight: 1 oz (1.4 mils) all layers
	Via plating thickness: 1 mil
	Surface finish: Electroless Nickel and Immersion Gold (ENIG)
	Top Silkscreen: White
	Bottom Silkscreen: No
	Top Solder Mask: Green
	Bottom Solder Mask: No
	No silkscreen on solder pads
	100% Electrical test used
	Impedance matching, +/- 10%: No
4. Solder paste stencil	Supplied for Top side
5. PCB Statistics	Components: 19
	Total Pads: 38
	Thru Hole Pads: 21
	Top SMT Pads: 17
	Bottom SMT Pads: 0
	Vias: 35
	Nets: 15

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