RO3003 PCB Supplier | Bicheng PCB

WELCOME TO BICHENG

Home
Company
Quality
Manufacture
Career
PCB Boards
- Newly Shipped RF PCB
- High Frequency PCB
Contact Us

4-layer Rogers PCB Built on 60mil RO3003 High Frequency Material with Immersion Silver for Pads

Shipped:16 th-May-2023

We are excited to introduce our high-quality PCB boards. This board is designed to meet the highest standards in performance and durability, featuring Rogers RO3003C material with lead-free processing for -40℃ to +85℃ operation.

The stackup consists of base copper weight of 17um, RO3003 60mil dielectric, base copper weight of 17um, FR-28 prepreg, base copper weight of 17um, RO3003 60mil dielectric, and base copper weight of 17um. This stackup delivers excellent electrical performance and is ideal for high-frequency applications.

The board dimensions are 132.00 x 154.00 mm, including tooling strips, with a minimum trace/space of 8/8 mils and a minimum hole size of 12 mils. There are no blind or buried vias, and the finished board thickness is 3.2mm with a finished copper weight of 1 oz (1.4 mils) all layers.

This PCB features immersion silver surface finish, green top solder mask, and no silkscreen on solder pads. A solder paste stencil is supplied for the top side, making assembly quick and straightforward. Our 100% electrical testing guarantees that the boards meet the highest industry standards.

The board has 29 components, 36 pads, 20 thru-hole pads, 11 top SMT pads, 5 bottom SMT pads, 98 vias, and 100 nets. Please note that impedance matching is not included, but a +/- 10% tolerance can be achieved.

Specifications	Value
1. PCB Material	Rogers RO3003C
	Lead-free process
	-40℃ to +85℃ operation
2. Stackup	Base copper 17um
	RO3003 60mil dielectric
	Base copper 17um
	FR-28 prepreg
	Base copper 17um
	RO3003 60mil dielectric
	Base copper 17um
3. Construction details	Board dimensions: 132.00 x 154.00mm=1PCS (including tooling strips), +/- 0.15mm
	Minimum Trace/Space: 8/8 mils
	Minimum Hole Size: 12 mils
	No blind or buried vias
	Finished board thickness: 3.2mm
	Finished Cu weight: 1 oz (1.4 mils) all layers
	Via plating thickness: 1 mil
	Surface finish: Immersion Silver
	Top Silkscreen: No
	Bottom Silkscreen: No
	Top Solder Mask: Green
	Bottom Solder Mask: No
	No silkscreen on solder pads
	100% Electrical test used
	Impedance matching, +/- 10%: No
4. Solder paste stencil	Supplied for Top side
5. PCB Statistics	Components: 29
	Total Pads: 36
	Thru Hole Pads: 20
	Top SMT Pads: 11
	Bottom SMT Pads: 5
	Vias: 98
	Nets: 100

BACK TO CONTENT OF MAY