Shenzhen Bicheng Electronics Technology Co., Ltd
深圳市碧澄电子科技有限公司
+86-755-27374946
info@bicheng-enterprise.com
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RO4003C Double Sided, Dual Layer Rogers PCB Built on 20mil Substrates with Copper Filled via

Shipped: 15th-May-2023  

Bicheng Limited is proud to present our high-quality PCB featuring Rogers RO4003C material with lead-free processing for -40℃ to +85℃ operation. The board is designed to meet the highest standards in performance and durability, ensuring reliability for your application.

The stackup consists of base copper weight of 17um, 20mil dielectric, and base copper weight of 17um, delivering excellent electrical performance. The board dimensions are 78.00 x 53.00 mm, including tooling strips, with a minimum trace/space of 6/6 mils and a minimum hole size of 12 mils. There are no blind or buried vias, and the finished board thickness is 0.6mm with a finished copper weight of 1 oz (1.4 mils) all layers.

This PCB also features immersion silver surface finish and no silkscreen or solder mask. A panelized solder paste stencil is supplied for the top side, and a minimum via needs to be filled by copper paste for better thermal dissipation.
The board features 31 components, 92 pads, 51 thru-hole pads, 15 top SMT pads, 26 bottom SMT pads, 59 vias, and 75 nets. We take pride in our 100% electrical testing, ensuring that our boards meet the highest industry standards.
If you have any technical questions or inquiries, please do not hesitate to contact our team at sales@bicheng-enterprise.com. Copyright Bicheng Limited., 2023. All rights reserved.
 
 

Specifications

Value

 

1. PCB Material

 

Rogers RO4003C

Lead-free process

-40℃ to +85℃ operation

 

2. Stackup

 

Base copper 17um

RO4003C 20mil dielectric

Base copper 17um

 

 

 

 

 

 

3. Construction details

 

 

 

 

 

 

Board dimensions: 78.00 x 53.00mm=1PCS (including tooling strips), +/- 0.15mm

Minimum Trace/Space: 6/6 mils

Minimum Hole Size: 12 mils

No blind or buried vias

Finished board thickness: 0.6mm

Finished Cu weight: 1 oz (1.4 mils) all layers

Via plating thickness: 1 mil

Surface finish: Immersion silver

No top or bottom silkscreen

No top or bottom solder mask

No silkscreen on solder pads

100% Electrical test used

Minimum via needs to be filled by copper paste for better thermal dissipation

4. Panelized solder paste stencils

Supplied for Top side

 

 

 

5. PCB Statistics

 

 

 

Components: 31

Total Pads: 92

Thru Hole Pads: 51

Top SMT Pads: 15

Bottom SMT Pads: 26

Vias: 59

Nets: 75

 
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