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IT180A 6-Layer Hybrid PCB Built on Rogers RO4350B Microwave Material and ITEQ High Tg Substrates with Immersion Gold

Shipped: 12th-May-2023

We are thrilled to introduce our latest 6-layer hybrid PCBs which are designed to meet the highest standards in performance and durability. This board features a combination of Rogers RO4350B and ITEQ IT180A FR-4 material with lead-free processing for -40℃ to +85℃ operation.

The stackup consists of a base copper weight of 35um, 10mil RO4350B, prepreg, and IT180A FR-4. The board dimensions are 98.00 x 95.00 mm, including tooling strips, with a minimum trace/space of 6/6 mils and a minimum hole size of 10 mils. There are no blind or buried vias, and slotted holes defined as per Gerber are plated through.

The finished board thickness is 1.6mm, and the finished copper weight is 1 oz (1.4 mils) all layers. The surface finish is ENIG (Electroless Nickle and Immersion Gold), with top and bottom silkscreens in white and matt black top and bottom solder masks. There is no silkscreen on solder pads

To achieve impedance matching of 50ohms +/- 10%, we use a top layer of 18mil/10mil track and spacing and a reference layer 2. For ease of use, a panelized solder paste stencil is supplied for the top side.

The board features 107 components, 235 pads, 71 thru-hole pads, 79 top SMT pads, 85 bottom SMT pads, 263 vias, and 81 nets. We use resin to fill and cap 0.25mm and 0.3mm vias as per IPC-4761 Type VII to ensure the highest level of quality and durability.

Our 100% electrical test guarantees that the boards meet the highest industry standards. For any technical questions or inquiries, please contact us at sales@bicheng-enterprise.com. Thank you for choosing Bicheng Limited. Copyright Bicheng Limited., 2023. All rights reserved

Specifications	Value
1. PCB Material	Rogers RO4350B + ITEQ IT180A FR-4
	Lead-free process
	-40℃ to +85℃ operation
2. Stackup	6-layer hybrid PCB
	Base copper 35um
	10mil RO4350B
	Base copper 35um
	Prepreg
	IT180A FR-4
	Base copper 35um
	IT180A FR-4
	Base copper 35um
	Prepreg
	Base copper 35um
	10mil RO4350B
	Base copper 35um
3. Construction details	Board dimensions: 98.00 x 95.00 mm=1PCS (including tooling strips), +/- 0.15mm
	Minimum Trace/Space: 6/6 mils
	Minimum Hole Size: 10 mils
	No blind or buried vias
	Sloted holes defined as per Gerber are to be plated through, the side-by-side holes define the dimensions of the slots
	Finished board thickness: 1.6mm
	Finished Cu weight: 1 oz (1.4 mils) all layers
	Via plating thickness: 1 mil
	Surface finish: ENIG(Electroless Nickle and Immersion Gold)
	Top Silkscreen: White
	Bottom Silkscreen: White
	Top Solder Mask: Matt Black
	Bottom Solder Mask: Matt Black
	No silkscreen on solder pads
	100% Electrical test used
	0.25mm and 0.3mm via filled by resin and capped as per IPC-4761 Type VII
4. Impedance matching	50ohm, +/- 10%
	Top layer 18mil/10mil track and spacing
	Reference layer 2
5. Panelized solder paste stencils	Supplied for Top side
6. PCB Statistics	Components: 107
	Total Pads: 235
	Thru Hole Pads: 71
	Top SMT Pads: 79
	Bottom SMT Pads: 85
	Vias: 263
	Nets: 81

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