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RO4003C Double Sided Rogers PCB Built on 32mil (0.813mm) High Frequency Material with Immersion Gold

Shipped: 10th-May-2023

We are excited to introduce our latest PCBs designed to meet the highest standards in performance and reliability. This double-sided board is constructed using Rogers RO4003C material and features lead-free processing for -40℃ to +85℃ operation.

With a base copper weight of 17um and a dielectric of 32mil, the stackup offers superior performance and durability. The board dimensions are 180.00 x 156.00 mm, with a minimum trace/space of 6/6 mils and a minimum hole size of 15 mils. There are no blind or buried vias, and slotted holes defined per Gerber are plated through.

The board thickness is 0.98mm, and the finished copper weight is 1 oz (1.4 mils) all layers. The surface finish is ENIG (Immersion gold), with the top solder mask in green and no bottom solder mask. There is no top or bottom silkscreen, and impedance matching is not included.

For ease of use, a panelized solder paste stencil is supplied for the top side. The board features 210 components, 306 pads, 129 thru-hole pads, 90 top SMT pads, 87 bottom SMT pads, 331 vias, and 118 nets.

The panelization details are as per Gerber, and the breakouts in the panel must align with board breakouts as per design. We are committed to providing the highest level of quality and performance, and our 100% electrical test ensures that our boards meet the highest industry standards.

Specifications	Value
1. PCB Material	Rogers RO4003C
	Lead-free process
	-40℃ to +85℃ operation
2. Stackup	Double Sided PCB
	Base copper 17um
	RO4003C dielectric 32mil
	base copper 17um
3. Construction details	Board dimensions: 180.00 x 156.00 mm=2 PCS, +/- 0.15mm
	Minimum Trace/Space: 6/6 mils
	Minimum Hole Size: 15 mils
	No blind or buried vias
	Slotted holes defined as per Gerber are plated through
	Finished board thickness: 0.98mm
	Breakouts in panel must align with board breakouts as per design
	Panelization details are as per Gerber
	Finished Cu weight: 1 oz (1.4 mils) all layers
	Via plating thickness: 1 mil
	Surface finish: ENIG (Immersion gold)
	Top Silkscreen: No
	Bottom Silkscreen: No
	Top Solder Mask: Green
	Bottom Solder Mask: No
	No silkscreen on solder pads
	100% Electrical test used
4. Impedance matching	No
5. Panelized solder paste stencils	Supplied for Top side
6. PCB Statistics	Components: 210
	Total Pads: 306
	Thru Hole Pads: 129
	Top SMT Pads: 90
	Bottom SMT Pads: 87
	Vias: 331
	Nets: 118

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