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RO4003C Double Sided, Dual Layer Rogers PCB Built on 60mil Substrates with Immersion Gold

Shipped: 9th-May-2023

This double-sided PCB is built on Rogers RO4003C material with lead-free processing for reliable operation at temperatures ranging from -40℃ to +85℃.

With a base copper weight of 17um and a dielectric of 60mil, the stackup offers excellent performance and durability. The finished board thickness is 1.7mm, and the finished copper weight is 1 oz (1.4 mils) all layers.

The board dimensions are 32.00 x 54.00 mm, with a minimum trace/space of 6/8 mils and a minimum hole size of 17 mils. There are no blind or buried vias, ensuring maximum reliability and ease of use.

The PCB also features 19 components, 24 pads, 9 thru-hole pads, 17 top SMT pads, 8 bottom SMT pads, 98 vias, and 115 nets. Although impedance matching is not included, a panelized solder paste stencil is supplied for the top side.

The surface finish is Immersion Gold (ENIG), and the top silkscreen is not present. The top solder mask is green, while the bottom solder mask is absent. Additionally, there is no silkscreen on solder pads.

Specifications	Value
1. PCB Material	Rogers RO4003C
	Lead-free process
	-40℃ to +85℃ operation
2. Stackup	Double Sided PCB
	Base copper 17um
	RO4003C dielectric 60mil
	base copper 17um
3. Construction details	Board dimensions: 32.00 x 54.00 mm=1 PCS, +/- 0.15mm
	Minimum Trace/Space: 6/8 mils
	Minimum Hole Size: 17 mils
	No blind or buried vias
	Finished board thickness: 1.7mm
	Finished Cu weight: 1 oz (1.4 mils) all layers
	Via plating thickness: 1 mil
	Surface finish: Immersion gold (ENIG)
	Top Silkscreen: No
	Bottom Silkscreen: No
	Top Solder Mask: Green
	Bottom Solder Mask: No
	No silkscreen on solder pads
	100% Electrical test used
4. Impedance matching	No
5. Panelized solder paste stencils	Supplied for Top side
6. PCB Statistics	Components: 19
	Total Pads: 24
	Thru Hole Pads: 9
	Top SMT Pads: 17
	Bottom SMT Pads: 8
	Vias: 98
	Nets: 115

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