RO3006 PCB Supplier | Bicheng PCB

WELCOME TO BICHENG

Home
Company
Quality
Manufacture
Career
PCB Boards
- Newly Shipped RF PCB
- High Frequency PCB
Contact Us

RO3006 Double Sided Dual Layer Rogers PCB Built on 25mil 0.635mm High Frequency Material with ENIG Finish on Pads

Shipped: 30th-May-2023

We are excited to announce our newest RF PCB in May of 2023. This high-performance PCB is designed to meet the needs of various electronic applications, featuring Rogers RO3006 material and a lead-free process that allows for operation in temperatures ranging from -40℃ to +85℃.

The board has a 2-layer stackup with a base copper of 17um, a dielectric layer of 25mil, and a base copper of 17um. It has a finished board thickness of 0.8mm and a finished Cu weight of 1 oz (1.4 mils) for all layers. The board dimensions are 156.00 x 122.00 mm, with a tolerance of +/- 0.15mm.

With a minimum trace/space of 6/5 mils and a minimum hole size of 17 mils, this PCB is highly versatile for various electronic applications. It has no blind or buried vias and plated slotted holes defined as per Gerber. The surface finish is immersion gold (ENIG), and the top silkscreen is black, with no silkscreen on the solder pads.

The PCB has 98 components, 286 total pads, 166 thru-hole pads, 58 top SMT pads, 62 bottom SMT pads, 88 vias, and 170 nets, making it a high-performance PCB suitable for various electronic applications. Impedance matching is not included.

A panelized solder paste stencil is provided for the top sides, ensuring accurate and efficient soldering. For technical inquiries or questions, please contact Bicheng Limited via sales@bicheng-enterprise.com

Specifications	Value
PCB Material	Rogers RO3006
Lead-free process	Yes
Operating temperature	-40℃ to +85℃
Stackup	2-layer PCB
	Base copper 17um
	Dielectric 25mil
	Base copper 17um
Construction details	Board dimensions: 156.00 x 122.00 mm = 3 Types = 3 PCS, +/- 0.15mm
	Minimum Trace/Space: 6/5 mils
	Minimum Hole Size: 17 mils
	No blind or buried vias
	Plated slotted holes defined as per Gerber
	Finished board thickness: 0.8 mm
	Breakouts in panel as per design, aligned with board breakouts
	Panelization details as per Gerber
	All edges tab-routed, non-plated holes for breakouts included in Gerbers, breakouts shown as per design FabDrawing
	Finished Cu weight: 1 oz (1.4 mils) all layers
	Via plating thickness: 1 mil
	Surface finish: Immersion gold (ENIG)
	Top Silkscreen: Black
	Bottom Silkscreen: No
	Top/Bottom Solder Mask: No
	No silkscreen on solder pads
	100% Electrical test used
Impedance matching	No, +/- 10%
Solder paste stencil	Panelized for top sides
PCB Statistics	Components: 98
	Total Pads: 286
	Thru Hole Pads: 166
	Top SMT Pads: 58
	Bottom SMT Pads: 62
	Vias: 88
	Nets: 170

BACK TO CONTENT OF MAY