Shenzhen Bicheng Electronics Technology Co., Ltd
深圳市碧澄电子科技有限公司
+86-755-27374946
info@bicheng-enterprise.com
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RO4003C Double Sided 2-layer Rogers PCB Built on 8mil High Temperature Substrates with Immersion Gold on Pads

Shipped: 26th-May-2023  

We are excited to announce the release of our latest RF PCB on May 26th 2003.

This high-quality PCB is designed to meet the needs of a wide range of electronic applications, featuring Rogers RO4003C material and a lead-free process that allows for operation in temperatures ranging from -40℃ to +85℃.

The board has a 2-layer stackup with a base copper of 35um, dielectric of 8mil, and base copper of 35um. It has a finished board thickness of 0.37mm and a finished Cu weight of 1.5 oz (2.1 mils) for all layers. The board dimensions are 110.00 x 85.00 mm, with a tolerance of +/- 0.15mm.
With a minimum trace/space of 5/5 mils and a minimum hole size of 15 mils, this PCB is highly versatile for various electronic applications. It has no blind or buried vias and plated slotted holes defined as per Gerber. The surface finish is ENIG, and the top silkscreen is absent, while the bottom silkscreen is also absent, and top/bottom solder masks are green/no.
The PCB has 90 components, 341 total pads, 169 thru-hole pads, 67 top SMT pads, 105 bottom SMT pads, 215 vias, and 236 nets, making it a high-performance PCB suitable for various electronic applications. Impedance matching is not included.
A panelized solder paste stencil is provided for the top sides, ensuring accurate and efficient soldering. For technical inquiries or questions, please contact Bicheng Limited via sales@bicheng-enterprise.com
 
 

Specifications

Value

PCB Material

Rogers RO4003C

Lead-free process

Yes

Operating temperature

-40℃ to +85℃

 

Stackup

 

 

2-layer PCB

Base copper 35um

Dielectric 8mil

Base copper 35um

 

 

 

 

 

 

 

 

Construction details

 

 

 

 

 

 

 

 

Board dimensions: 110.00 x 85.00 mm=4 Types = 4 PCS, +/- 0.15mm

Minimum Trace/Space: 5/5 mils

Minimum Hole Size: 15 mils

No blind or buried vias

Plated slotted holes defined as per Gerber

Finished board thickness: 0.37 mm

Breakouts in panel as per design, aligned with board breakouts

Panelization details as per Gerber

All edges tab-routed, non-plated holes for breakouts included in Gerbers, breakouts shown as per design FabDrawing

Finished Cu weight: 1.5 oz (2.1 mils) all layers

Via plating thickness: 1 mil

Surface finish: ENIG

Top Silkscreen: No

Bottom Silkscreen: No

Top/Bottom Solder Mask: Green/No

No silkscreen on solder pads

100% Electrical test used

Impedance matching

No, +/- 10%

Solder paste stencil

Panelized for top sides

 

 

 

PCB Statistics

 

 

 

Components: 90

Total Pads: 341

Thru Hole Pads: 169

Top SMT Pads: 67

Bottom SMT Pads: 105

Vias: 215

Nets: 236

 
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