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RT/duroid 6035HTC Double Sided Dual Layer Rogers PCB Built on High Thermal Conductivity Material with ENIG on Pads

Shipped: 26th-May-2023

We’re thrilled to introduce the latest RF PCB from Bicheng Limited on May 26th 2023.

This high-quality PCB is designed to meet the needs of a wide range of electronic applications, featuring Rogers RT/duroid 6035HTC material and a lead-free process that allows for operation in temperatures ranging from -40℃ to +85℃.

The board is a 2-layer PCB with a base copper of 17um, dielectric of 20mil, and base copper of 17um. It has a finished board thickness of 0.65mm and a finished Cu weight of 1 oz (1.4 mils) for each layer. The board dimensions are 240.00 x 122.00 mm, with a tolerance of +/- 0.15mm.

The board has a minimum trace/space of 6/6 mils and a minimum hole size of 16 mils. It has no blind or buried vias, and plated slotted holes are defined as per Gerber. The surface finish is ENIG, and the top silkscreen is black, while the bottom silkscreen and top/bottom solder masks are absent. The board undergoes 100% electrical testing to ensure functionality.

The PCB has 150 components, 325 total pads, 166 thru-hole pads, 58 top SMT pads, 101 bottom SMT pads, 219 vias, and 186 nets, making it versatile for various electronic applications. Impedance matching is not included.

A panelized solder paste stencil is provided for the top sides, ensuring accurate and efficient soldering. For technical inquiries or questions, please contact Bicheng Limited via sales@bicheng-enterprise.com.

Specifications	Value
PCB Material	Rogers RT/duroid 6035HTC
Lead-free process	Yes
Operating temperature	-40℃ to +85℃
Stackup	2-layer PCB
	Base copper 17um
	Dielectric 20mil
	Base copper 17um
Construction details	Board dimensions: 240.00 x 122.00 mm =12 Types = 12 PCS, +/- 0.15mm
	Minimum Trace/Space: 6/6 mils
	Minimum Hole Size: 16 mils
	No blind or buried vias
	Plated slotted holes defined as per Gerber
	Finished board thickness: 0.65 mm
	Breakouts in panel as per design, aligned with board breakouts
	Panelization details as per Gerber
	All edges tab-routed, non-plated holes for breakouts included in Gerbers, breakouts shown as per design FabDrawing
	Finished Cu weight: 1 oz (1.4 mils) all layers
	Via plating thickness: 1 mil
	Surface finish: ENIG
	Top Silkscreen: Black
	Bottom Silkscreen: No
	Top/Bottom Solder Mask: No
	No silkscreen on solder pads
	100% Electrical test used
Impedance matching	No
Solder paste stencil	Panelized for top sides
PCB Statistics	Components: 150
	Total Pads: 325
	Thru Hole Pads: 166
	Top SMT Pads: 58
	Bottom SMT Pads: 101
	Vias: 219
	Nets: 186

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