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RO4003C 4-layer Hybrid PCB Multilayer Board Built on Rogers Material and Isola FR408HR with Impedance Control and Via Filled

Shipped: 25th-May-2023

We’re happy to introduce a newly shipped RF PCB offered by Bicheng Limited on May 25th 2023.

This high-quality PCB is made with a hybrid stackup of Rogers RO4003C and Isola FR408HR materials, utilizing a lead-free process and suitable for a wide temperature range of -40℃ to +85℃.

The board features a 4-layer hybrid stackup with a finished board thickness of 1.6mm and a finished Cu weight of 1 oz (1.4 mils) each layer. With dimensions of 70.00 x 120.00 mm and a tolerance of +/- 0.15mm, the board offers a well-defined structure to house your electronics.

The minimum trace/space is 6/7 mils, and the minimum hole size is 12 mils. The board has no blind or buried vias, and all IC pads are filled with resin and capped as per IPC-4761 Type VII.

The surface finish is ENIG (Electroless Nickle and Immersion Gold), providing excellent conductivity and corrosion resistance. The top and bottom solder masks are green, and the top and bottom silkscreens are white. There is no silkscreen on the solder pads, making it ideal for applications where discretion is required. The board has undergone 100% electrical testing to ensure functionality.

The PCB has 121 components, 322 total pads, and 171 vias, making it a highly versatile option for various electronic applications. Impedance matching, +/- 10%, is included for a 50ohm 12mil single-end trace on the top layer with reference layer 2.

A panelized solder paste stencil is provided for the top sides, ensuring accurate and efficient soldering. For any technical inquiries or questions, please contact Bicheng Limited via sales@bicheng-enterprise.com

Specifications	Value
PCB Material	Rogers RO4003C + Isola FR408HR Hybrid PCB
Lead-free process	Yes
Operating temperature	-40℃ to +85℃
Stackup	4-layer hybrid PCB
	0.5oz+plating GND
	FR-408HR 7628 12mil
	1oz GND
	FR-408HR 7628 -
	1oz GND
	Rogers4003C 12mil
	0.5oz+plating Signal
Board dimensions	70.00 x 120.00 mm = 1PCS, +/- 0.15mm
Minimum Trace/Space	6/7 mils
Minimum Hole Size	12 mils
Blind/buried vias	None
Finished board thickness	1.6 mm
Finished Cu weight	1 oz (1.4 mils) all layers
Via plating thickness	1 mil
Surface finish	ENIG(Electroless Nickle and Immersion Gold)
Top Silkscreen	White
Bottom Silkscreen	White
Top Solder Mask	Green
Bottom Solder Mask	Green
Silkscreen on solder pads	No
Electrical test	100%
Via filling	Via filled by resin and capped as per IPC-4761 Type VII under IC pads
Impedance matching	50ohm 12mil single-end trace, +/- 10%, top layer, reference layer 2
Solder paste stencil	Panelized for top sides
Components	121
Total Pads	322
Thru Hole Pads	151
Top SMT Pads	79
Bottom SMT Pads	92
Vias	171
Nets	115

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