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RO4003C Double Sided 2-Layer Rogers PCB Built on 32mil RF Material with via filled and ENIG Finish

Shipped: 24th-May-2023

We’re excited to introduce a newly shipped RF PCB offered by Bicheng Limited on May 24th,2023

This high-quality PCB is made with Rogers RO4003C material and uses a lead-free process, making it environmentally friendly and suitable for a temperature range of -40℃ to +85℃.

The board features a base copper of 17um, a dielectric of 32mil, and another base copper of 17um, with a finished board thickness of 0.98 mm. The board dimensions are 82.00 x 108.00 mm, with a tolerance of +/- 0.15mm. The minimum trace/space is 6/7 mils, and the minimum hole size is 19.69 mils. The board has no blind or buried vias, and slotted holes, defined as per Gerber, are plated through, side-by-side holes defining the slot dimensions. The finished Cu weight is 1 oz (1.4 mils) all layers, and the via plating thickness is 1 mil.

The surface finish is ENIG (Electroless Nickle and Immersion Gold), providing excellent conductivity and corrosion resistance. The top solder mask is green, and the bottom solder mask is also green. There is no silkscreen on the solder pads, making it ideal for applications where discretion is required. The board has 100% electrical testing and 0.5mm via, filled by resin, and capped as per IPC-4761 Type VII.

The PCB has 97 components, 163 total pads, and 100 vias, making it a highly versatile option for various electronic applications. Impedance matching, +/- 10%, is not included, and a panelized solder paste stencil is provided for the top sides, ensuring accurate and efficient soldering.

For technical inquiries or questions, please contact Bicheng Limited via sales@bicheng-enterprise.com. Choose Bicheng Limited for a top-quality RF PCB that meets your needs and exceeds your expectations.

Specifications	Value
PCB Material	Rogers RO4003C
Lead-free process	Yes
Operating temperature	-40℃ to +85℃
Stackup	Double Sided PCB
	Base copper 17um
	RO4003C dielectric 32mil
	Base copper 17um
Board dimensions	82.00 x 108.00 mm = 1PCS, +/- 0.15mm
Minimum Trace/Space	6/7 mils
Minimum Hole Size	19.69 mils
Blind/buried vias	None
Finished board thickness	0.98 mm
Finished Cu weight	1 oz (1.4 mils) all layers
Via plating thickness	1 mil
Surface finish	ENIG (Electroless Nickle and Immersion Gold)
Top Silkscreen	No
Bottom Silkscreen	No
Top/Bottom Solder Mask	Top: Green, Bottom: Green
Silkscreen on solder pads	No
Electrical test	100%
Impedance matching	No (±10%)
Via filling	0.5mm, resin filled and capped (IPC-4761 Type VII)
Solder paste stencil	Panelized for top sides
Components	97
Total Pads	163
Thru Hole Pads	15
Top SMT Pads	67
Bottom SMT Pads	81
Vias	100
Nets	70

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