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RO4350B Low Profile Double Sided Rogers PCB Built on 32.7mil 0.831mm Substrates with Immersion Gold

Shipped: 30th-Aug-2023

The PCB material used is Rogers RO4350B LoPro with a reverse treated foil on a hydrocarbon ceramic woven glass substrate. It boasts a process DK of 3.48 at 10 GHz/23°C, enabling optimal signal transmission and stability. With a low dissipation factor of 0.0037 at 10 GHz/23°C, it minimizes signal loss and guarantees reliable communication. This PCB operates flawlessly within a temperature range of -40℃ to +85℃, making it suitable for a wide range of environmental conditions.

The stackup of this PCB features a 2-layer rigid design. It includes a 35 μm copper layer on the top and bottom, with a Rogers 4350B LoPro substrate measuring 0.831 mm in thickness. This carefully constructed stackup ensures excellent signal integrity and efficient circuitry layout.

The PCB has a board dimension of 93.55mm x 72.44mm, providing ample space for your circuitry needs. The minimum trace/space of 4.5/5 mils allows for intricate circuit designs, while the minimum hole size of 0.5mm enables precise component placement. The finished board thickness is 0.95mm, providing a sturdy and reliable solution. The outer layers have a 1 oz (1.4 mils) copper weight, ensuring durability and optimal conductivity. The via plating thickness of 20 μm guarantees reliable connections. The surface finish is Electroless Nickel Immersion Gold (ENIG), which offers excellent conductivity and corrosion resistance. The PCB features a green top and bottom solder mask for enhanced protection. Additionally, the 0.5mm vias are filled with resin and capped as per IPC-4761 Type VII specifications, ensuring reliable performance. Each PCB undergoes a thorough 100% electrical test prior to shipment to ensure functionality and reliability.

This PCB supports 86 components and provides a total of 144 pads for secure component connections. It includes 112 thru-hole pads, 27 top SMT pads, 5 bottom SMT pads, 138 vias, and 7 nets, facilitating efficient signal routing and reliable connectivity within your circuit design.

The artwork supplied for this PCB is in the Gerber RS-274-X format, ensuring compatibility and ease of use. It complies with the IPC-Class-2 standard, guaranteeing high-quality and reliable performance. Rest assured, this PCB is available for purchase worldwide, making it easily accessible to customers globally.

For any technical inquiries or further information, please don't hesitate to contact us at sales@bicheng-enterprise.com. Our dedicated team is ready to assist you in achieving your design goals.

Specifications	Value
PCB Material	Rogers RO4350B Low Profile Reverse Treated foil Hydrocarbon Ceramic Woven Glass
Process DK	3.48 at 10 GHz/23°C
Dissipation Factor	0.0037 at 10 GHz/23°C
Tg	>280 °C
Td	390°C
Operating Temperature	-40℃?to +85℃
Stackup	2-layer rigid PCB
Copper Layer 1	35 μm
Substrate Thickness	0.831 mm (32.7mil)
Copper Layer 2	35 μm
Board Dimensions	93.55mm x 72.44 mm
Minimum Trace/Space	4.5/5 mils
Minimum Hole Size	0.5mm
Finished Board Thickness	0.95mm
Finished Cu Weight	1 oz (1.4 mils)
Via Plating Thickness	20 μm
Surface Finish	Electroless Nickel Immersion Gold (ENIG)
Top Silkscreen	No
Bottom Silkscreen	No
Top Solder Mask	Green
Bottom Solder Mask	Green
Filled Vias	0.5mm vias filled by resin and capped as per IPC-4761 Type VII
Electrical Test	100%
Components	86
Total Pads	144
Thru Hole Pads	112
Top SMT Pads	27
Bottom SMT Pads	5
Vias	138
Nets	7
Artwork Format	Gerber RS-274-X
Accepted Standard	IPC-Class-2
Availability	Worldwide

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