RO4003C PCB Supplier | Bicheng PCB

WELCOME TO BICHENG

Home
Company
Quality
Manufacture
Career
PCB Boards
- Newly Shipped RF PCB
- High Frequency PCB
Contact Us

RO4003C Low Profile Double Sided Rogers PCB Built on 20.7mil 0.526mm Substrates with Immersion Gold

Shipped: 29th-Aug-2023

Introducing our newly shipped RF PCB, offered to meet the demanding requirements of high-frequency applications. This advanced PCB is constructed with top-of-the-line materials and precise engineering, ensuring exceptional performance and reliability.

The PCB material used is Rogers RO4003C LoPro, featuring a reverse treated foil on a hydrocarbon ceramic woven glass substrate. With a process DK of 3.38 at 10 GHz/23°C, it delivers optimal signal transmission and stability. The low dissipation factor of 0.0027 at 10 GHz/23°C minimizes signal loss, guaranteeing reliable communication. Operating within a temperature range of -40℃ to +85℃, it performs flawlessly in various environments.

The stackup of this PCB consists of a 2-layer rigid design. It includes a 35 μm copper layer on the top, a Rogers 4003C LoPro substrate with a thickness of 0.526 mm, and another 35 μm copper layer at the bottom. This thoughtfully engineered stackup ensures excellent signal integrity and efficient circuitry layout.

The PCB's construction details are meticulously designed to meet industry standards and exceed customer expectations. With a board dimension of 178.25mm x 76.43mm, it provides ample space for your RF circuitry. The minimum trace/space of 4/5 mils allows for intricate circuit designs, while the minimum hole size of 0.25mm enables precise component placement. The finished board thickness is 0.65mm, providing a compact and sturdy solution. The outer layers have a 1 oz (1.4 mils) copper weight, ensuring durability and optimal conductivity. The via plating thickness of 20 μm guarantees reliable connections. The surface finish is Electroless Nickel Immersion Gold (ENIG), providing excellent conductivity and corrosion resistance. The PCB includes a green top solder mask and a green bottom solder mask for enhanced protection. Additionally, the 0.25mm and 0.4mm vias are filled with resin and capped as per IPC-4761 Type VII specifications, ensuring reliable performance.

To ensure the highest quality, each PCB undergoes a thorough 100% electrical test prior to shipment, guaranteeing its functionality and reliability. The PCB statistics demonstrate its versatility and compatibility with various designs. It supports a total of 117 components and provides 163 pads for secure component connections. It includes 124 thru-hole pads, 32 top SMT pads, 7 bottom SMT pads, 148 vias, and 10 nets, facilitating efficient signal routing and reliable connectivity within your RF circuit design.

For convenience, the artwork supplied for this PCB is in the Gerber RS-274-X format, ensuring compatibility and ease of use. It complies with the IPC-Class-2 standard, guaranteeing high-quality and reliable performance. Rest assured, this PCB is available for purchase worldwide, making it easily accessible to customers around the globe.

Should you have any technical inquiries or require further information, our dedicated team is available to assist you. Please feel free to reach out to us at sales@bicheng-enterprise.com. We are committed to helping you achieve your RF design goals.

Specification	Value
PCB Material	Rogers RO4003C LoPro Reverse treated foil Hydrocarbon Ceramic woven glass
Process DK	3.38 at 10 GHz/23°C
Dissipation factor	0.0027 at 10 GHz/23°C
Tg (Glass Transition Temperature)	>280 °C
Td (Decomposition Temperature)	425°C
Operating Temperature Range	-40℃?to +85℃
Stackup	2-layer rigid PCB
Copper_layer_1 Thickness	35 μm
Substrate Thickness	0.526 mm
Copper_layer_2 Thickness	35 μm
Board Dimensions	178.25mm x 76.43 mm
Tolerance	+/- 0.15mm
Minimum Trace/Space	4/5 mils
Minimum Hole Size	0.25mm
Blind Vias	No
Finished Board Thickness	0.65mm
Finished Cu Weight	1 oz (1.4 mils) outer layers
Via Plating Thickness	20 μm
Surface Finish	Electroless Nickel Immersion Gold
Top Silkscreen	No
Bottom Silkscreen	No
Top Solder Mask	Green
Bottom Solder Mask	Green
Filled and Capped Vias	0.25mm and 0.4mm vias
	Resin filled, IPC-4761 Type VII
Electrical Test	100% prior to shipment
Components	117
Total Pads	163
Thru Hole Pads	124
Top SMT Pads	32
Bottom SMT Pads	7
Vias	148
Nets	10
Type of Artwork Supplied	Gerber RS-274-X
Accepted Standard	IPC-Class-2
Availability	Worldwide

BACK TO AUGUST