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RO3203 Double Sided Roger High Frequency PCB Built on 30mil 0.762mm Laminates with Immersion Gold

Shipped: 28th-Aug-2023

Introducing our high-quality PCB, crafted with precision and utilizing top-notch materials to meet the demanding requirements of various electronic applications. The PCB is constructed using Rogers RO3203, a ceramic-filled PTFE material reinforced with woven fiberglass, ensuring exceptional stability and durability. With a process DK of 3.02 at 10 GHz/23°C, it delivers optimal performance in high-frequency applications. The low dissipation factor of 0.0016 at 10 GHz/23°C minimizes signal loss, while its impressive Td of 500°C enables reliable operation in high-temperature environments ranging from -40℃ to +85℃.

The stackup of the PCB features a 2-layer rigid design, comprising copper_layer_1 with a thickness of 35 μm, a RO3203 substrate with a thickness of 0.762 mm (30mil), and copper_layer_2 also measuring 35 μm. This thoughtfully engineered stackup ensures excellent signal integrity and reliable performance.

The PCB's construction details are meticulously designed to meet industry standards and exceed customer expectations. With dimensions of 196.88mm x 50.64 mm and a tolerance of +/- 0.15mm, it provides ample space for your circuitry. The minimum trace/space of 6/5 mils allows for intricate circuit designs, while the minimum hole size of 0.3mm enables precise component placement. This PCB does not include blind vias. Its finished board thickness of 0.89mm, combined with a 1oz (1.4 mils) outer layer copper weight, ensures durability and stability. The via plating thickness of 20 μm guarantees reliable connections. The surface finish is an immersion gold coating, offering excellent conductivity and corrosion resistance. The PCB includes a top solder mask in green, and the bottom solder mask is also green. Additionally, it undergoes a thorough 100% electrical test prior to shipment to ensure its functionality and reliability.

The PCB statistics demonstrate its versatility and compatibility with various designs. It supports a total of 57 components and provides 112 pads for secure component connections. With 165 thru-hole pads, 42 top SMT pads, 10 bottom SMT pads, 85 vias, and 9 nets, this PCB facilitates efficient signal routing and reliable connectivity within your circuit design.

For convenience, the artwork supplied for this PCB is in the Gerber RS-274-X format, ensuring compatibility and ease of use. It complies with the IPC-Class-2 standard, guaranteeing high-quality and reliable performance. Rest assured, this PCB is available for purchase worldwide, making it easily accessible to customers around the globe.

Should you have any technical inquiries or require further information, our dedicated team is available to assist you. Please feel free to reach out to us at sales@bicheng-enterprise.com. We are committed to helping you achieve your electronic design goals.

Specifications	Value
PCB Material	Rogers RO3203 ceramic-filled PTFE reinforced with woven fiberglass
Process DK	3.02 at 10 GHz/23°C
Dissipation Factor	0.0016 at 10 GHz/23°C
Td	500°C
Operating Temperature Range	-40℃?to +85℃
Layers	2-layer rigid PCB
Copper_layer_1	35 μm
Substrate (RO3203)	0.762 mm (30mil)
Copper_layer_2	35 μm
Board Dimensions	196.88mm x 50.64 mm=1PCS, +/- 0.15mm
Minimum Trace/Space	6/5 mils
Minimum Hole Size	0.3mm
Blind Vias	No
Finished Board Thickness	0.89mm
Finished Cu Weight	1oz (1.4 mils) outer layers
Via Plating Thickness	20 μm
Surface Finish	Immersion Gold
Top Silkscreen	No
Bottom Silkscreen	No
Top Solder Mask	Green
Bottom Solder Mask	Green
Electrical Test	100% Electrical test used prior to shipment
Components	57
Total Pads	112
Thru Hole Pads	165
Top SMT Pads	42
Bottom SMT Pads	10
Vias	85
Nets	9
Type of Artwork Supplied	Gerber RS-274-X
Accepted Standard	IPC-Class-2
Availability	Worldwide

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