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RO3210 Double Sided Rogers RF PCB Built on 25mil 0.635mm Laminates with Immersion Gold

Shipped: 22nd-Aug-2023

We're thrilled to present our cutting-edge RF PCB, delivering unparalleled performance and reliability. The newly launched PCB features Rogers RO3210 ceramic-filled PTFE reinforced with woven fiberglass, ensuring exceptional quality and durability. With a Process DK of 10.2 at 10 GHz/23°C and a dissipation factor of 0.0027 at the same frequency and temperature, The RF PCB guarantees excellent signal integrity, minimizing losses. It boasts a high thermal stability, surpassing 500°C, and operates flawlessly between -40℃ to +85℃.

The 2-layer rigid PCB stackup comprises copper layers with a thickness of 35 μm, sandwiching a RO3210 substrate of 0.635 mm (25mil). The construction ensures optimal signal transmission and durability.

The board dimensions are 161.5mm x 110 mm with a tolerance of +/- 0.15mm, supporting a minimum trace/space of 4/4 mils. It accommodates holes as small as 0.45mm and features a finished board thickness of 0.76mm. The outer layers have a 1oz (1.4 mils) copper weight, and the via plating thickness is 20 μm. With an immersion gold surface finish and green solder masks on the top and bottom layers, The RF PCB offers excellent conductivity and corrosion resistance.

Each PCB undergoes a thorough 100% electrical test prior to shipment, ensuring optimal functionality and reliability. With 122 components, 190 pads, 131 thru-hole pads, 47 top SMT pads, 12 bottom SMT pads, 212 vias, and 9 nets, the RF PCB enables intricate and versatile circuit designs.

You provide the artwork in Gerber RS-274-X format, conforming to the widely accepted IPC-Class-2 standard. Our RF PCB is available worldwide, and our dedicated team can be reached at sales@bicheng-enterprise.com for any technical inquiries or assistance.

Parameter	Value
PCB Material	Rogers RO3210 ceramic-filled PTFE reinforced with woven fiberglass
Process DK	10.2 at 10 GHz/23°C
Dissipation Factor	0.0027 at 10 GHz/23°C
Thermal Stability	Td > 500°C
Operating Temperature Range	-40℃?to +85℃
Stackup	2-layer rigid PCB
Copper Layer 1 Thickness	35 μm
Substrate Thickness	0.635 mm (25mil)
Copper Layer 2 Thickness	35 μm
Board Dimensions	161.5mm x 110 mm
Tolerance	+/- 0.15mm
Minimum Trace/Space	4/4 mils
Minimum Hole Size	0.45mm
Blind Vias	None
Finished Board Thickness	0.76mm
Outer Layer Copper Weight	1oz (1.4 mils)
Via Plating Thickness	20 μm
Surface Finish	Immersion Gold
Top Silkscreen	No
Bottom Silkscreen	No
Top Solder Mask	Green
Bottom Solder Mask	Green
Electrical Test	100%
Components	122
Total Pads	190
Thru-hole Pads	131
Top SMT Pads	47
Bottom SMT Pads	12
Vias	212
Nets	9
Artwork Format	Gerber RS-274-X
Compliance Standard	IPC-Class-2
Availability	Worldwide

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