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TLY-3 Double Sided Taconic High Frequency PCB Built on 20mil 0.508mm Laminates With Immersion Silver

Shipped: 20th-Aug-2023

This PCB incorporates Taconic TLY-3 woven fiberglass PTFE composites, offering exceptional performance and reliability for your electronic designs. The TLY-3 substrate, with a thickness of 0.508 mm (20mil), provides excellent electrical properties and durability. With a process DK of 2.33 at 10 GHz/23°C, this PCB ensures precise signal transmission and optimal performance. It operates flawlessly within a wide temperature range of -40℃ to +85℃, making it suitable for various environments and applications.

The stackup of this 2-layer rigid PCB consists of two copper layers with a thickness of 35 μm, sandwiching the TLY-3 substrate. This construction ensures efficient signal flow and impedance control, enabling reliable performance for your electronic designs.

With a board size of 141.5mm x 163mm, this PCB provides ample space for your circuitry and components. Each PCB is manufactured with a tolerance of +/- 0.15mm, ensuring precise dimensions and accurate alignment of components. The minimum trace/space is 4/4 mils, allowing for high-density traces and compact designs. The minimum hole size is 0.35mm, providing flexibility in component mounting options. This PCB does not include blind vias.

The finished board thickness is 0.63mm, providing a lightweight and compact solution for your electronic applications. The outer layers feature a finished copper weight of 1oz (1.4 mils), ensuring optimal conductivity and reliable electrical performance. The via plating thickness is 20 μm, offering robust connections and efficient grounding. The surface finish is immersion silver, providing excellent solderability and corrosion resistance.

This PCB does not include top or bottom silkscreen, maintaining a clean and professional appearance. However, it features a green top solder mask for visual clarity and protection. Each PCB undergoes a meticulous 100% electrical test prior to shipment, ensuring superior quality and performance. With 183 components and a total of 250 pads, this PCB offers versatility and flexibility in circuit configurations. It includes 139 thru-hole pads, 92 top SMT pads, and 19 bottom SMT pads, accommodating various component mounting options for your electronic designs. The PCB includes 90 vias and supports 8 nets, enabling efficient and reliable circuit connections.

The supplied artwork format for this PCB is Gerber RS-274-X, ensuring compatibility with standard design and manufacturing processes. It meets IPC-Class-2 standards, guaranteeing consistent quality and reliability. This PCB is available for worldwide shipping, allowing you to access our superior electronic solutions wherever you are. For any technical inquiries or further information, please don't hesitate to contact our dedicated team at sales@bicheng-enterprise.com.

Parameter	Value
PCB Material	Taconic TLY-3 Woven fiberglass PTFE composites
Process DK	2.33 at 10 GHz/23°C
Operating Temperature	-40℃?to +85℃
Stackup	2-layer rigid PCB
Copper_layer_1	35 μm
Substrate (TLY-3)	0.508 mm (20mil)
Copper_layer_2	35 μm
Board Dimensions	141.5mm x 163mm
Tolerance	+/- 0.15mm
Minimum Trace/Space	4/4 mils
Minimum Hole Size	0.35mm
Blind vias	No
Finished board thickness	0.63mm
Finished Cu weight (outer layers)	1oz (1.4 mils)
Via plating thickness	20 μm
Surface finish	Immersion silver
Top Silkscreen	No
Bottom Silkscreen	No
Top Solder Mask	Green
Bottom Solder Mask	No
Electrical Test	100%
Components	183
Total Pads	250
Thru Hole Pads	139
Top SMT Pads	92
Bottom SMT Pads	19
Vias	90
Nets	8
Artwork Format	Gerber RS-274-X
Accepted Standard	IPC-Class-2
Availability	Worldwide

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