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TLF-35A Double Sided Taconic High Frequency PCB Built on 30mil 0.762mm Substrates with Immersion Gold

Shipped: 19th-Aug-2023

This 2-layer rigid PCB integrates Taconic TLF-35A fiberglass Ceramic-filled PTFE composites, delivering exceptional performance and reliability for your RF designs.

With a process DK of 3.5 at 10 GHz/23°C and a dissipation factor of 0.0026 at the same frequency and temperature, this RF PCB ensures precise and efficient signal transmission, minimizing signal loss and maximizing signal integrity. It operates flawlessly across a wide temperature range of -40℃ to +85℃, making it well-suited for diverse environments and applications.

The stackup of this 2-layer rigid PCB comprises copper layers with a thickness of 35 μm, encasing the TLF-35A substrate measuring 0.762 mm (30mil) in thickness. This construction delivers excellent electrical properties, impedance control, and reliable performance for your RF designs.

With generous board dimensions of 141.5mm x 90mm, this RF PCB provides ample space for your RF circuitry and components. Each PCB is manufactured with a tolerance of +/- 0.15mm, ensuring precise dimensions and accurate alignment of components. The minimum trace/space is 4/5 mils, allowing for high-density routing and compact designs. You can take advantage of the minimum hole size of 0.5mm, enabling versatile component mounting options. Notably, this PCB does not include blind vias.

Boasting a finished board thickness of 0.88mm, this RF PCB offers a lightweight and compact solution for your RF applications. The outer layers sport a finished copper weight of 1oz (1.4 mils), ensuring optimal conductivity and dependable electrical performance. The via plating thickness of 20 μm provides robust connections and efficient grounding. The surface finish is Immersion Gold, guaranteeing excellent solderability and corrosion resistance.

While this RF PCB does not feature top silkscreen, it maintains a clean and professional appearance. However, it does include a green top solder mask and green bottom solder mask, offering visual clarity and safeguarding your RF circuitry. Each PCB undergoes a meticulous 100% electrical test before shipment, ensuring superior quality and performance.

Equipped with 137 components and a total of 190 pads, this RF PCB provides versatility and flexibility in circuit configurations. It comprises 131 thru-hole pads, 43 top SMT pads, and 16 bottom SMT pads, accommodating various component mounting options for your RF designs. With 211 vias and support for 9 nets, you can achieve efficient and reliable circuit connections. The supplied artwork format for this RF PCB is Gerber RS-274-X, ensuring compatibility with standard design and manufacturing processes. It adheres to IPC-Class-2 standards, ensuring consistent quality and reliability. Moreover, this RF PCB is available for worldwide shipping, enabling you to access our superior electronic solutions wherever you are. For technical inquiries or further information, please feel free to contact our dedicated team at sales@bicheng-enterprise.com. Discover the exceptional performance and reliability of our newly launched RF PCB, tailored for your RF and high-frequency applications.

Parameter	Value
Product Name	RF PCB
Layer Count	2
Substrate Material	Taconic TLF-35A
Substrate Thickness	0.762 mm (30mil)
Copper Thickness	35 μm
Process DK	3.5 at 10 GHz/23°C
Dissipation Factor	0.0026 at 10 GHz/23°C
Operating Temperature	-40℃?to +85℃
Board Dimensions	141.5mm x 90mm
Tolerance	+/- 0.15mm
Minimum Trace/Space	4/5 mils
Minimum Hole Size	0.5mm
Blind Vias	Not included
Finished Board Thickness	0.88mm
Finished Copper Weight	1oz (1.4 mils)
Via Plating Thickness	20 μm
Surface Finish	Immersion Gold
Top Silkscreen	Not included
Top Solder Mask Color	Green
Bottom Solder Mask Color	Green
Electrical Test	100%
Components	137
Total Pads	190
Thru-hole Pads	131
Top SMT Pads	43
Bottom SMT Pads	16
Vias	211
Nets	9
Artwork Format	Gerber RS-274-X
Standards	IPC-Class-2
Availability	Worldwide Shipping

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