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TLX-6 Dual Layer Taconic High Frequency PCB Built on 60mill 1.524mm Substrates with Immersion Gold

Shipped: 18th-Aug-2023

This 2-layer rigid PCB incorporates advanced technology and utilizes Taconic TLX-6 fiberglass fabric with PTFE composites, ensuring exceptional signal integrity and minimal signal loss.

With a process DK of 2.65 at 10 GHz/23°C, this RF PCB offers precise and efficient signal transmission, allowing for high-frequency operation without compromising performance. It operates flawlessly within a wide temperature range of -40℃ to +85℃, making it suitable for various environments and applications.

The stackup of this 2-layer rigid PCB includes copper layers with a thickness of 35 μm, sandwiching the TLX-6 substrate with a thickness of 1.524 mm (60mil). This construction ensures excellent RF characteristics, impedance control, and reliable performance for your RF designs.

With board dimensions of 124.65mm x 135mm, this RF PCB provides ample space for your RF circuitry and components. Each PCB is manufactured with a tolerance of +/- 0.15mm, ensuring precise dimensions and accurate alignment of components. The minimum trace/space is 4/4 mils, allowing for intricate traces and compact designs. The minimum hole size is 0.35mm, enabling versatile component mounting options. This PCB does not include blind vias.

The finished board thickness is 1.64mm, offering durability and stability for your RF applications. The outer layers feature a finished copper weight of 1oz (1.4 mils), guaranteeing optimal conductivity and reliable electrical performance. The via plating thickness is 20 μm, providing robust connections and efficient grounding. The surface finish is Immersion Gold, ensuring excellent solderability and corrosion resistance.

This RF PCB does not have top silkscreen, maintaining a clean and professional appearance. However, it features a green top solder mask and no bottom silkscreen, providing visual clarity and protection for your RF circuitry. Each PCB undergoes a meticulous 100% electrical test prior to shipment, ensuring superior quality and performance.

With 149 components and a total of 223 pads, this RF PCB offers versatility and flexibility in circuit configurations. It includes 142 thru-hole pads, 54 top SMT pads, and 27 bottom SMT pads, accommodating various component mounting options for your RF designs. The PCB includes 81 vias and supports 7 nets, enabling efficient and reliable circuit connections. The supplied artwork format for this RF PCB is Gerber RS-274-X, ensuring compatibility with standard design and manufacturing processes. It meets IPC-Class-2 standards, guaranteeing consistent quality and reliability. This RF PCB is available for worldwide shipping, allowing you to access our superior electronic solutions wherever you are. For any technical inquiries or further information, please don't hesitate to contact our dedicated team at sales@bicheng-enterprise.com. Experience the exceptional performance and reliability of our newly shipped RF PCB for your RF and wireless communication projects.

Specification	Value
PCB Material	Taconic TLX-6 fiberglass fabric with PTFE composites
Process DK	2.65, at 10 GHz/23°C
Operation Temperature	-40℃?to +85℃
Stackup	2-layer rigid PCB
Copper Layer 1 Thickness	35 μm
Substrate Thickness	1.524 mm (60mil)
Copper Layer 2 Thickness	35 μm
Board Dimensions	124.65mm x 135 mm = 1PCS, +/- 0.15mm
Minimum Trace/Space	4/4 mils
Minimum Hole Size	0.35mm
Blind Vias	No
Finished Board Thickness	1.64mm
Finished Cu Weight	1oz (1.4 mils) outer layers
Via Plating Thickness	20 μm
Surface Finish	Immersion Gold
Top Silkscreen	No
Bottom Silkscreen	No
Top Solder Mask	Green
Bottom Solder Mask	No
Electrical Test	100% Electrical test used prior to shipment
Components	149
Total Pads	223
Thru Hole Pads	142
Top SMT Pads	54
Bottom SMT Pads	27
Vias	81
Nets	7
Type of Artwork Supplied	Gerber RS-274-X
Accepted Standard	IPC-Class-2
Availability	Worldwide

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