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RT/duroid 5870 Double Sided Rogers PCB built on 31mil 0.787mm Laminates with Immersion Gold

Shipped: 15th-Aug-2023

This 2-layer Rogers PCB is constructed using RT/duroid 5870 glass microfiber reinforced PTFE composites, offering excellent electrical properties and thermal stability. With a process DK of 2.33 at 10 GHz/23°C and a dissipation factor of 0.0012 at the same frequency and temperature, this PCB ensures reliable signal transmission for your high-frequency applications.

The PCB material exhibits impressive thermal resistance with a Td exceeding 500°C, making it suitable for demanding operating conditions. It has an operational temperature range from -40℃ to +85℃, providing versatility in various environments.

The stackup of this PCB includes two copper layers with a thickness of 35 μm, sandwiching the RT/duroid 5870 substrate with a thickness of 0.787 mm (31mil). This construction ensures stability and signal integrity while accommodating a wide range of circuit designs.

With a board dimension of 315.12mm x 139.85mm, this PCB offers ample space for your circuit requirements. It comes in a set of three pieces, representing three types, with a tolerance of +/- 0.15mm. The minimum trace/space is 5/6 mils, enabling precise traces of high-frequency signals. The minimum hole size is 0.3mm, accommodating various component types. This PCB does not include blind vias.

The finished board thickness is 0.91mm, providing a robust and reliable platform for your circuitry. The outer layers have a finished copper weight of 1oz (1.4 mils), ensuring excellent conductivity. The via plating thickness is 20 μm, enabling reliable signal transmission and efficient grounding. The surface finish is Immersion Gold, offering excellent solderability and corrosion resistance.

This PCB does not have top or bottom silkscreens, allowing for a clean and minimalistic design. The top solder mask is green, providing visual contrast and clarity. The bottom solder mask is also green. Each PCB undergoes a 100% electrical test prior to shipment, ensuring optimum functionality.

With 102 components and a total of 240 pads, this PCB provides versatility in circuit configurations. It features 126 thru-hole pads and 114 top SMT pads, accommodating various component mounting options. There are no bottom SMT pads in this design. The PCB includes 78 vias and supports six nets for efficient circuit connections. The supplied artwork format for this PCB is Gerber RS-274-X, ensuring compatibility with standard design and manufacturing processes. It meets IPC-Class-2 standards, guaranteeing consistent quality and reliability. This PCB is available worldwide, and for any technical inquiries, please contact us at sales@bicheng-enterprise.com.

Specification	Value
PCB Material	Rogers RT/duroid 5870 glass microfiber reinforced PTFE composites
Process DK	2.33, at 10 GHz/23°C
Dissipation Factor	0.0012, at 10 GHz/23°C
Td	> 500°C
Operation Temperature	-40℃?to +85℃
Stackup	2-layer rigid PCB
Copper Layer 1 Thickness	35 μm
Substrate Thickness	0.787 mm (31mil)
Copper Layer 2 Thickness	35 μm
Board Dimensions	315.12mm x 139.85 mm = 3PCS = 3Types, +/- 0.15mm
Minimum Trace/Space	5/6 mils
Minimum Hole Size	0.3mm
Blind Vias	No
Finished Board Thickness	0.91mm
Finished Cu Weight	1oz (1.4 mils) outer layers
Via Plating Thickness	20 μm
Surface Finish	Immersion Gold
Top Silkscreen	No
Bottom Silkscreen	No
Top Solder Mask	Green
Bottom Solder Mask	Green
Electrical Test	100% Electrical test used prior to shipment
Components	102
Total Pads	240
Thru Hole Pads	126
Top SMT Pads	114
Bottom SMT Pads	0
Vias	78
Nets	6
Type of Artwork Supplied	Gerber RS-274-X
Accepted Standard	IPC-Class-2
Availability	Worldwide

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