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RO4350B Hybrid Printed Circuit Boards Built on 10mil Substrates and Tg 170°C FR-4 Material with 6-layer and Immersion Gold

Shipped: 14th-Aug-2023

This PCB combines the superior properties of Rogers RO4350B hydrocarbon ceramic woven glass with a high Tg 170°C FR-4 material, ensuring exceptional performance and reliability. With an operating temperature range of -40℃ to +130℃, this RF PCB is suitable for a wide range of environmental conditions.

The stackup of this 6-layer rigid PCB is carefully offered to optimize signal integrity and impedance control. It features multiple copper layers with a thickness of 35 μm, sandwiching RO4350B cores and high Tg FR-4 cores. The precise layer arrangement provides a solid foundation for RF circuitry and enables effective impedance matching.

With a board dimension of 50mm x 38mm, this PCB offers a compact and space-efficient solution for your RF designs. It has a tolerance of +/- 0.15mm, ensuring precise manufacturing. The minimum trace/space is 4/4 mils, allowing for intricate traces of high-frequency signals. The minimum hole size is 0.1mm, accommodating various component types. This PCB does not include blind vias.

The finished board thickness is 1.0mm, providing a robust and reliable platform for your RF circuitry. Each layer has a finished copper weight of 1 oz (1.4 mils), ensuring excellent conductivity. The via plating thickness is 20 μm, enabling reliable signal transmission and efficient grounding. The surface finish is Electroless Nickel Immersion Gold (ENIG), offering excellent solderability and corrosion resistance.

The top and bottom silkscreens are white, providing clear component labeling for easy identification. The top solder mask is matt black, offering optimal contrast and visibility. The bottom solder mask also has a matt black finish. Silkscreen is forbidden onto solder pads to prevent any interference. Additionally, this PCB features a 50 ohm impedance controlled on the top layer with a 19.4mil trace, reference L2, ensuring precise signal matching.

This RF PCB includes 70 components and a total of 108 pads, providing versatility in circuit configurations. It features 65 thru-hole pads, 32 top SMT pads, and 11 bottom SMT pads, accommodating various component mounting options. The PCB includes 49 vias and supports 16 nets for efficient circuit connections.

The supplied artwork format for this PCB is Gerber RS-274-X, ensuring compatibility with standard design and manufacturing processes. It meets IPC-Class-2 standards, guaranteeing consistent quality and reliability. This RF PCB is available worldwide, and for any technical inquiries, please contact us at sales@bicheng-enterprise.com.

Specification	Value
PCB Material	Rogers RO4350B Hydrocarbon Ceramic woven glass + High Tg 170°C FR-4
Operation Temperature	-40℃?to +130℃
Stackup	6-layer rigid PCB
	Copper ???????Layer-1 ?????35 micron
	RO4350B ????Core 0.254mm (10mil)
	Copper ???????Layer-2 ?????35 micron
	Prepreg ??????High Tg 1080 0.0750mm
	Copper ???????Layer-3 ?????35 micron
	FR-4 Core ???High Tg ????0.11mm
	Copper ???????Layer-4 ?????35 micron
	Prepreg ??????High Tg ????0.075mm
	Copper ???????Layer-5 ?????35 micron
	RO4350B ?????Core 0.254mm (10mil)
	Copper ???????Layer-6 ?????35 micorn
Board Dimensions	50mm x 38mm = 1PCS, +/- 0.15mm
Minimum Trace/Space	4/4 mils
Minimum Hole Size	0.1mm
Blind Vias	No
Finished Board Thickness	1.0mm
Finished Cu Weight	1 oz (1.4 mils) each layer
Via Plating Thickness	20 μm
Surface Finish	Electroless Nickel Immersion Gold (ENIG)
Top Silkscreen	White
Bottom Silkscreen	White
Top Solder Mask	Matt black
Bottom Solder Mask	Matt black
Silkscreen on Solder Pads	Forbidden
Impedance Control	50 ohm on top layer, 19.4mil trace, reference L2
Filled Via	0.1mm via filled by resin and capped (IPC-4761 Type VII)
Electrical Test	100% Electrical test used prior to shipment
Components	70
Total Pads	108
Thru Hole Pads	65
Top SMT Pads	32
Bottom SMT Pads	11
Vias	49
Nets	16
Type of Artwork Supplied	Gerber RS-274-X
Accepted Standard	IPC-Class-2
Availability	Worldwide

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