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RO4003C Dual Layer Rogers High Frequency PCB Built on 12mil 0.305mm Laminates with Immersion Gold

Shipped: 12th-Aug-2023

This PCB is constructed using Rogers RO4003C hydrocarbon ceramic woven glass material, known for its outstanding electrical properties and durability. With a process DK of 3.38 at 10 GHz/23°C and a dissipation factor of 0.0027 at the same frequency and temperature, this PCB ensures excellent signal integrity and minimal power loss. It has a high glass transition temperature (Tg) above 280°C and thermal decomposition temperature (Td) above 425°C, making it suitable for demanding applications.

The stackup of this PCB consists of two copper layers, each with a thickness of 35 μm. The substrate, made of Rogers 4003C, measures 0.305 mm, providing a compact yet robust foundation for your circuitry.

With a board dimensions of 170.53mm x 180.35 mm, this PCB offers ample space for complex circuit designs. It has a tolerance of +/- 0.15mm, ensuring precise manufacturing. The minimum trace/space is 4/4 mils, allowing for intricate traces. The minimum hole size is 0.25mm, accommodating various component types. This PCB does not include blind vias.

The finished board thickness is 0.43mm, providing a lightweight and compact solution. The outer layers have a finished copper weight of 1 oz (1.4 mils), ensuring optimal conductivity. The via plating thickness is 20 μm, enabling reliable signal transmission. The surface finish is immersion gold, offering corrosion resistance and excellent solderability.

The top silkscreen is black, providing clear component labeling and enhancing visibility. The bottom silkscreen and top solder mask layers are not included for this PCB. Silkscreen is forbidden onto solder pads to prevent any interference. This PCB undergoes a 100% electrical test prior to shipment, ensuring exceptional quality and performance.

With an impressive component count of 115 and a total of 217 pads, this PCB offers versatility in circuit configurations. It features 112 thru-hole pads and 105 top SMT pads, accommodating various component mounting options. The PCB includes 168 vias and supports 5 nets for efficient circuit connections.

The supplied artwork format for this PCB is Gerber RS-274-X, ensuring compatibility with standard design and manufacturing processes. It meets IPC-Class-2 standards, guaranteeing consistent quality and reliability. This PCB is available worldwide, and for any technical inquiries, please contact us at sales@bicheng-enterprise.com.

Specification	Value
PCB Material	Rogers RO4003C Hydrocarbon Ceramic woven glass
Process DK	3.38 at 10 GHz/23°C
Dissipation Factor	0.0027 at 10 GHz/23°C
Tg (Glass Transition Temp.)	>280°C
Td (Thermal Decomposition)	>425°C
Operation Temperature	-40℃?to +85℃
Stackup	2-layer rigid PCB
Copper Layer 1	35 μm
Substrate (Rogers 4003C)	0.305 mm
Copper Layer 2	35 μm
Board Dimensions	170.53mm x 180.35 mm = 2PCS = 2Types, +/- 0.15mm
Minimum Trace/Space	4/4 mils
Minimum Hole Size	0.25mm
Blind Vias	No
Finished Board Thickness	0.43mm
Finished Cu Weight	1 oz (1.4 mils) outer layers
Via Plating Thickness	20 μm
Surface Finish	Immersion Gold
Top Silkscreen	Black
Bottom Silkscreen	No
Top Solder Mask	No
Bottom Solder Mask	No
Silkscreen on Solder Pads	Forbidden
Electrical Test	100% Electrical test used prior to shipment
Components	115
Total Pads	217
Thru Hole Pads	112
Top SMT Pads	105
Bottom SMT Pads	0
Vias	168
Nets	5
Type of Artwork Supplied	Gerber RS-274-X
Accepted Standard	IPC-Class-2
Availability	Worldwide

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