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RT/duroid 6035HTC Double Sided Rogers RF PCB Built on 20mil 0.508mm Substrates with Immersion Silver

Shipped: 10th-Aug-2023

This PCB is crafted using Rogers RT/duroid 6035HTC ceramic filled PTFE composites, ensuring exceptional electrical characteristics and stability. With a process DK of 3.5 at 10 GHz/23°C and a dissipation factor of 0.0013 at the same frequency, this PCB guarantees superior signal integrity and minimal loss. It features a TCDK of -66 ppm/°C during a temperature range of -50°C to 150°C, providing excellent thermal stability. Operating within a range of -40°C to +85°C, this PCB is well-suited for a variety of applications.

The stackup of this PCB consists of a 2-layer rigid design, optimized for simplicity and ease of use. The copper layer thickness is 35 μm, ensuring good conductivity and signal transmission. The substrate is constructed using Rogers RT/duroid 6035HTC, measuring 0.508 mm (20mil) in thickness, offering a sturdy and reliable foundation. The second copper layer, also 35 μm thick, completes the stackup.

The construction details of this PCB are carefully considered to meet your specific requirements. With board dimensions of 89.24mm x 11.8mm and a manufacturing tolerance of +/- 0.15mm, this PCB offers precise dimensions for your application. It supports a minimum trace/space width of 5/5 mils, accommodating intricate circuit designs. The minimum hole size is 0.35mm, allowing for versatile component integration. This PCB does not include blind vias.

With a finished board thickness of 0.63mm, this PCB strikes a balance between durability and flexibility. The outer layers have a copper weight of 1 oz (1.4 mils), ensuring efficient current flow. The vias are plated with a thickness of 20 μm, providing robust interconnectivity and durability. The surface finish is Immersion Silver, offering excellent solderability and corrosion resistance.

The top and bottom silkscreens are not included in the design, enabling a clean and minimalist aesthetic. The top solder mask has a green finish, providing protection against solder bridging and environmental factors. The bottom solder mask is omitted. Each PCB undergoes a thorough 100% electrical test prior to shipment, ensuring optimal functionality and reliability.

In terms of statistics, this PCB can accommodate up to 128 components and offers a total of 112 pads, including 81 thru-hole pads, 20 top SMT pads, and 11 bottom SMT pads. It includes 100 vias for interconnection and supports organized signal routing with 6 nets.

The design files are provided in Gerber RS-274-X format, ensuring compatibility with common PCB fabrication processes. The PCB adheres to the IPC-Class-2 standard, guaranteeing high quality and reliability. It is available for purchase worldwide, and for any technical inquiries, please contact our sales team at sales@bicheng-enterprise.com.

Specifications	Value
PCB Material	Rogers RT/duroid 6035HTC ceramic filled PTFE composites
Process DK	3.5 at 10 GHz/23°C
Dissipation Factor	0.0013 at 10 GHz/23°C
TCDK	-66 ppm/°C during -50°C to 150°C
Operating Temperature Range	-40°C to +85°C
Stackup	2-layer rigid PCB
Copper Layer 1 Thickness	35 μm
Substrate Thickness	0.508 mm (20mil)
Copper Layer 2 Thickness	35 μm
Board Dimensions	89.24mm x 11.8mm = 1PCS, +/- 0.15mm
Minimum Trace/Space	5/5 mils
Minimum Hole Size	0.35mm
Blind Vias	None
Finished Board Thickness	0.63mm
Finished Cu Weight	1 oz (1.4 mils) outer layers
Via Plating Thickness	20 μm
Surface Finish	Immersion Silver
Top Silkscreen	No
Bottom Silkscreen	No
Top Solder Mask	Green
Bottom Solder Mask	No
Electrical Test	100% prior to shipment
Components	128
Total Pads	112
Thru Hole Pads	81
Top SMT Pads	20
Bottom SMT Pads	11
Vias	100
Nets	6
Type of Artwork Supplied	Gerber RS-274-X
Accepted Standard	IPC-Class-2
Availability	Worldwide

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