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RO4835 6-Layer Hybrid PCB Built on Rogers 4mil Substrates and High Tg FR-4 With Blind Via and Immersion Gold

Shipped: 9th-Aug-2023

This PCB is constructed with Rogers RO4835 hydrocarbon ceramic woven glass combined with High Tg 170°C FR-4 material, ensuring optimal functionality in a wide temperature range of -40℃ to +130℃.

The 6-layer rigid stackup of this PCB is meticulously offered for superior signal integrity and performance. It consists of copper layers with a thickness of 35 microns, a RO4835 core measuring 0.1016mm (4mil), high Tg prepreg layers of 0.254mm, and high Tg FR-4 cores of 0.254mm. The stackup is completed with copper layers and an FR-4 core, both measuring 35 microns.

The construction details of this PCB are thoughtfully considered. With a compact board size of 56.4mm x 54mm and a manufacturing tolerance of +/- 0.15mm, it offers precise dimensions. The minimum trace/space width is 4/4 mils, accommodating intricate circuit designs. It supports a minimum hole size of 0.20mm and includes blind vias from L1 to L2.

With a finished board thickness of 1.20mm, this PCB provides stability and durability. Each copper layer has a weight of 1 oz (1.4 mils), ensuring excellent conductivity. The vias are plated with a thickness of 20 μm, guaranteeing durability and optimal electrical performance. The surface finish is Electroless Nickel Immersion Gold (ENIG), offering corrosion resistance and superior solderability.

The top and bottom silkscreens are in white, providing clear component labeling. The top and bottom solder masks have a green finish, delivering protection against solder bridging and environmental factors. Silkscreen printing is not allowed on solder pads to ensure proper soldering and prevent shorts.

This PCB supports 90 ohm impedance control on the top layer for 14mil traces, referencing L2. Prior to shipment, each PCB undergoes a thorough 100% electrical test to verify functionality and reliability.

In terms of statistics, the PCB can accommodate up to 81 components and offers a total of 141 pads, including 77 thru-hole pads, 43 top SMT pads, and 21 bottom SMT pads. It includes 151 vias for interconnection and supports organized signal routing with 19 nets. The design files are provided in Gerber RS-274-X format, ensuring compatibility with common PCB fabrication processes. The PCB adheres to the IPC-Class-2 standard, guaranteeing high quality and reliability. It is available for purchase worldwide, and for any technical inquiries, please contact our sales team at sales@bicheng-enterprise.com.

Specifications	Value
PCB Material	Rogers RO4835 Hydrocarbon Ceramic woven glass + High Tg 170°C FR-4
Operating Temperature Range	-40℃?to +130℃
Stackup	6-layer rigid PCB
	Copper ??????Layer-1 ?????35 micron
	RO4835 ?????Core 0.1016mm (4mil)
	Copper ??????Layer-2 ?????35 micron
	Prepreg ?????High Tg 0.254mm
	Copper ??????Layer-3 ?????35 micron
	FR-4 Core ???High Tg ????0.254mm
	Copper ??????Layer-4 ?????35 micron
	Prepreg ?????High Tg ????0.254mm
	Copper ??????Layer-5 ?????35 micron
	FR-4 Core ???High Tg ??0.1016mm (4mil)
	Copper ???????Layer-6 ?????35 micorn
Board Dimensions	56.4mm x 54mm = 1PCS, +/- 0.15mm
Minimum Trace/Space	4/4 mils
Minimum Hole Size	0.20mm
Blind Vias	L1-L2
Finished Board Thickness	1.20mm
Finished Cu Weight	1 oz (1.4 mils) each layer
Via Plating Thickness	20 μm
Surface Finish	Electroless Nickel Immersion Gold (ENIG)
Top Silkscreen	White
Bottom Silkscreen	White
Top Solder Mask	Green
Bottom Solder Mask	Green
Silkscreen on Solder Pads	Forbidden
Impedance Control	90 ohm, top layer, 14mil trace, reference L2
Electrical Test	100% prior to shipment
Components	81
Total Pads	141
Thru Hole Pads	77
Top SMT Pads	43
Bottom SMT Pads	21
Vias	151
Nets	19
Type of Artwork Supplied	Gerber RS-274-X
Accepted Standard	IPC-Class-2
Availability	Worldwide

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