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RO4003C 6-Layer Hybrid PCB Built on High Tg FR-4 With via filled and Impedance Control

Shipped: 8th-Aug-2023

This PCB combines Rogers RO4003C hydrocarbon ceramic woven glass with high Tg 170°C FR-4, allowing it to operate flawlessly in temperatures ranging from -40℃ to +130℃.

With a well-structured 6-layer rigid stackup, this PCB ensures optimal signal integrity and performance. It consists of copper layers with a thickness of 35 microns, RO4003C cores measuring 0.305mm (12mil), high Tg prepreg layers of 0.0762mm, and high Tg FR-4 cores of 0.18mm. The stackup is completed with copper layers and RO4003C cores, both measuring 35 microns.

The construction details of this PCB are carefully considered. It has a compact board size of 76mm x 54mm with a manufacturing tolerance of +/- 0.15mm. The minimum trace/space width is 5/4 mils, accommodating intricate circuit designs. It supports minimum hole sizes of 0.20mm and does not include blind vias.

With a finished board thickness of 1.10mm, this PCB offers stability and durability. Each copper layer has a weight of 1 oz (1.4 mils), ensuring excellent conductivity. The vias are plated with a thickness of 20 μm, providing durability and conductivity. The surface finish is Electroless Nickel Immersion Gold (ENIG), which offers corrosion resistance and superior solderability.

The top and bottom silkscreens are in white, allowing for clear component labeling. The top and bottom solder masks have a matte blue finish, providing protection against solder bridging and environmental factors. Silkscreen printing is restricted from solder pads to ensure proper soldering and prevent shorts.

The PCB features filled and capped vias, adhering to IPC-4761 Type VII standards. It supports 50 ohm impedance control on the top layer for 20mil traces, referencing L2. Before shipment, each PCB undergoes a thorough 100% electrical test to verify functionality and reliability.

In terms of statistics, the PCB can accommodate up to 112 components and offers a total of 186 pads, including 89 thru-hole pads, 50 top SMT pads, and 47 bottom SMT pads. It includes 185 vias for interconnection and supports organized signal routing with 8 nets. The design files are provided in Gerber RS-274-X format, ensuring compatibility with common PCB fabrication processes. The PCB adheres to the IPC-Class-2 standard, guaranteeing high quality and reliability. It is available for purchase worldwide, and our sales team at sales@bicheng-enterprise.com is ready to assist with any technical inquiries.

Specifications	Value
PCB Material	Rogers RO4003C Hydrocarbon Ceramic woven glass + High Tg 170°C FR-4
Operating Temperature Range	-40℃?to +130℃
Stackup	6-layer rigid PCB
	Copper ???Layer-1 ?????35 micron
	RO4003C ?Core ???????0.305mm (12mil)
	Copper ????Layer-2 ?????35 micron
	Prepreg ???High Tg ?????0.0762mm
	Copper ???Layer-3 ?????35 micron
	FR-4 Core ??High Tg ????0.18mm
	Copper ????Layer-4 ?????35 micron
	Prepreg ????High Tg ????0.0762mm
	Copper ?????Layer-5 ?????35 micron
	RO4003C ??Core ??????0.305mm (12mil)
	Copper ???Layer-6 ?????35 micorn
Board Dimensions	76mm x 54mm = 1PCS, +/- 0.15mm
Minimum Trace/Space	5/4 mils
Minimum Hole Size	0.20mm
Blind Vias	No
Finished Board Thickness	1.10mm
Finished Cu Weight	1 oz (1.4 mils) each layer
Via Plating Thickness	20 μm
Surface Finish	Electroless Nickel Immersion Gold (ENIG)
Top Silkscreen	White
Bottom Silkscreen	White
Top Solder Mask	Matt blue
Bottom Solder Mask	Matt blue
Silkscreen on Solder Pads	Forbidden
Filled and Capped Vias	0.25mm and 0.2mm (IPC-4761 Type VII)
Impedance Control	50 ohm, top layer, 20mil trace, reference L2
Electrical Test	100% prior to shipment
Components	112
Total Pads	186
Thru Hole Pads	89
Top SMT Pads	50
Bottom SMT Pads	47
Vias	185
Nets	8
Type of Artwork Supplied	Gerber RS-274-X
Accepted Standard	IPC-Class-2
Availability	Worldwide

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