Shenzhen Bicheng Electronics Technology Co., Ltd
深圳市碧澄电子科技有限公司
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info@bicheng-enterprise.com
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RO3010 Dual Layer Rogers High Dielectric Constant (DK) RF PCB Built on 25mil 0.635mm Laminates with HASL Lead Free

Shipped: 7th-Aug-2023  

Introducing our high-quality PCB, meticulously designed for superior performance and durability.

Constructed with Rogers RO3010 ceramic-filled PTFE composites, the PCB boasts exceptional reliability. Its dielectric constant of 10.2 at 10 GHz/23°C and dissipation factor of 0.0022 ensure impeccable signal integrity. With a decomposition temperature exceeding 500°C and an operational range from -40℃ to +85℃, it excels in demanding environments.

The 2-layer rigid PCB features a thoughtfully engineered stackup. It comprises a 35 μm copper layer on top, a 0.635 mm Rogers RO3010 substrate in the middle, and another 35 μm copper layer at the bottom. This configuration optimizes electrical performance and mechanical stability.
Designed with precision, the PCB offers a host of beneficial construction details. It measures 98.38mm x 70mm, combining versatility with a tolerance of +/- 0.15mm. The minimum trace width of 4.5 mils and spacing of 5.5 mils accommodate high-density circuitry and efficient signal trace. Supporting minimum hole sizes of 0.4mm, it enables precise component placement. The finished board thickness of 0.7mm strikes the perfect balance between compactness and durability. With 1 oz (1.4 mils) outer layer copper weight, it ensures excellent conductivity and heat dissipation. The 20 μm via plating thickness guarantees reliable connections, while the Hot Air Soldering Level surface finish enhances solderability and provides protection against oxidation. The absence of silkscreen and solder mask on the top and bottom surfaces creates a clean and minimalist appearance. Rest assured, each PCB undergoes a comprehensive 100% electrical test before shipment to meet the highest quality standards.
The PCB statistics showcase its capabilities. With 51 components and a total of 67 pads, including 41 thru-hole pads and 26 top SMT pads, it offers versatility in connectivity. Supporting 78 vias and 6 nets, it facilitates efficient signal routing and interconnection.
The PCB design is supplied in Gerber RS-274-X format, a widely accepted industry standard. It adheres to IPC-Class-2 standards, guaranteeing reliability and quality.
Our PCB is available worldwide, ensuring accessibility for customers around the globe. For any technical inquiries or further information, please reach out to us at sales@bicheng-enterprise.com. Our dedicated team is ready to assist you in finding the perfect solution for your PCB needs.
 
 

Description

Value

PCB Material

Rogers RO3010 ceramic-filled PTFE composites

- Dielectric constant

10.2 at 10 GHz/23°C

- Dissipation factor

0.0022 at 10 GHz/23°C

- Td

> 500°C

- Operating Temperature

-40℃?to +85℃

Stackup

- Copper_layer_1

35 μm

- Substrate (Rogers RO3010)

0.635 mm

- Copper_layer_2

35 μm

Construction details

- Board dimensions

98.38mm x 70mm = 2PCS = 2 Types

- Minimum Trace/Space

4.5/5.5 mils

- Minimum Hole Size

0.4mm

- Blind vias

No

- Finished board thickness

0.7mm

- Finished Cu weight

1 oz (1.4 mils) outer layers

- Via plating thickness

20 μm

- Surface finish

Hot Air Soldering Level (HASL)

- Top Silkscreen

No

- Bottom Silkscreen

No

- Top Solder Mask

No

- Bottom Solder Mask

No

- Electrical test

100% prior to shipment

PCB Statistics

- Components

51

- Total Pads

67

- Thru Hole Pads

41

- Top SMT Pads

26

- Bottom SMT Pads

0

- Vias

78

- Nets

6

Type of artwork supplied

Gerber RS-274-X

Accepted standard

IPC-Class-2

Availability

Worldwide

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