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RO4003C Rogers High Frequency PCB Built on 20mil 0.508mm Laminates with Via Filled

Shipped: 4th-Aug-2023

Introducing our top-of-the-line PCB, meticulously offered to meet the demanding needs of modern electronic applications. Our PCB is crafted with exceptional materials and precise construction, ensuring that it delivers reliable performance and long-lasting durability. Let's dive into the remarkable features and specifications:

Firstly, The PCB is built using Rogers RO4003C, a high-quality hydrocarbon ceramic woven glass material. It's specifically engineered to provide outstanding signal integrity and thermal stability. Even at high frequencies, with a process DK of 3.38 at 10 GHz/23°C and an impressively low dissipation factor of 0.0027 at the same frequency, the PCB guarantees exceptional performance. Moreover, it boasts a high glass transition temperature (Tg >280 °C) and decomposition temperature (Td >425°C), making it incredibly resilient in harsh operating conditions. You can rely on the PCB to function flawlessly within a wide temperature range, from -40℃ to +85℃.

Now, let's talk about the construction. The PCB features a sturdy 2-layer rigid design. The copper layer 1 has a thickness of 35 μm, while the substrate (Rogers 4003C) measures 0.508 mm in thickness. Correspondingly, the copper layer 2 also maintains a thickness of 35 μm. This carefully engineered stackup ensures rock-solid stability and robustness.

Moving on to the construction details, the board dimensions are 229.71mm x 151.93 mm, providing ample space for your designs. With a tolerance of +/- 0.15mm, you can rely on the precision of the PCB. It supports a minimum trace/space of 3.5/3.5 mils, allowing you to create intricate and compact designs. Additionally, the PCB accommodates hole sizes as small as 0.15mm, enabling you to push the boundaries of miniaturization. Notably, the PCB doesn't include blind vias, simplifying the manufacturing process. The finished board has a thickness of 0.63mm, striking an ideal balance between size and durability. The outer layers boast a copper weight of 1 oz (1.4 mils), ensuring optimal conductivity. To enhance reliability, the via plating thickness is 20 μm, facilitating secure connections. For a superior finish, the PCB is coated with Electroless Nickel Immersion Gold (ENIG), offering exceptional solderability and protection against corrosion. While there are no silkscreens on the top or bottom, the top solder mask is distinguishably green. To meet IPC-4761 Type VII standards, vias with sizes of 0.15mm, 0.25mm, and 0.4mm are filled with resin and capped. Rest assured, every PCB undergoes a comprehensive 100% electrical test before shipment, ensuring top-notch quality and functionality.

Let's talk numbers. The PCB can accommodate a total of 128 components, featuring 176 pads for seamless integration. Among these pads, 135 are designed for thru-hole connections, while 29 are dedicated to top surface mount technology (SMT), and 12 to bottom SMT. With 159 vias and support for 11 nets, you'll have the flexibility needed for efficient signal routing and connectivity.

Rest assured, we accept Gerber RS-274-X as the standard artwork format, widely recognized and utilized across the industry. Furthermore, the PCB adheres to the esteemed IPC-Class-2 standard, a testament to its quality and reliability.

Unleash your creativity! Our high-quality PCB is available for shipping worldwide, ensuring you can access it no matter where you are located. We pride ourselves on providing exceptional customer service and technical support. If you have any questions or inquiries, our experienced sales team is here to assist you. Reach out to us at sales@bicheng-enterprise.com, and let's find the perfect PCB solution tailored to your specific needs. Elevate your electronic projects to new heights with the reliability and performance of our top-of-the-line PCB.

Specification	Value
PCB Material	Rogers RO4003C Hydrocarbon Ceramic woven glass
	Prcoess DK 3.38, at 10 GHz/23°C
	Dissipation factor 0.0027, at 10 GHz/23°C
	Tg >280 °C, Td> 425°C
	-40℃?to +85℃?operation
Stackup	2-layer rigid PCB
	Copper_layer_1 - 35 μm
	Substrate (Rogers 4003C) - 0.508 mm
	Copper_layer_2 - 35 μm
Construction Details	Board dimensions: 229.71mm x 151.93 mm=15PCS=10Types, +/- 0.15mm
	Minimum Trace/Space: 3.5/3.5 mils
	Minimum Hole Size: 0.15mm
	No Blind vias.
	Finished board thickness: 0.63mm
	Finished Cu weight: 1 oz (1.4 mils) outer layers
	Via plating thickness: 20 μm
	Surface finish: Electroless Nickel Immersion Gold (ENIG)
	Top Silkscreen: No
	Bottom Silkscreen: No
	Top Solder Mask: Green
	Bottom Solder Mask: No
	0.15mm, 0.25mm and 0.4mm vias are filled by resin and capped as per IPC-4761 Type VII
	100% Electrical test used prior to shipment
PCB Statistics	Components: 128
	Total Pads: 176
	Thru Hole Pads: 135
	Top SMT Pads: 29
	Bottom SMT Pads: 12
	Vias: 159
	Nets: 11
Supplied Format	Gerber RS-274-X
Accepted Standard	IPC-Class-2
Shipping Availability	Worldwide

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