This PCB is made of Rogers RO4003C, a hydrocarbon ceramic woven glass material, providing excellent properties for signal integrity. With a process DK of 3.38 at 10 GHz/23°C and a low dissipation factor of 0.0027, it ensures optimal performance even at high frequencies. The PCB has a high glass transition temperature (Tg >280°C) and decomposition temperature (Td >425°C), making it suitable for demanding environments. It can operate flawlessly within a wide temperature range of -40°C to +85°C.

The stackup consists of a 2-layer rigid PCB with 35 μm copper on each layer and a substrate thickness of 0.813 mm, ensuring robustness and stability. The construction details include precise board dimensions of 29.73mm x 21.01mm with a tolerance of +/- 0.15mm. It supports fine trace/space requirements of 3.5/4 mils and accommodates small hole sizes down to 0.2mm. The finished board thickness is 0.93mm, providing a compact form factor. The outer layers have a copper weight of 1 oz (1.4 mils), and the via plating thickness is 20 μm. The surface finish is Immersion Gold (ENIG), providing excellent solderability and corrosion resistance. The PCB is designed without top and bottom silkscreens, and the top solder mask is green for identification and protection. The vias with 0.2mm and 0.25mm sizes are filled with resin and capped as per IPC-4761 Type VII standards. Before shipment, each PCB undergoes a rigorous 100% Electrical Test to ensure quality and functionality.