Shenzhen Bicheng Electronics Technology Co., Ltd
深圳市碧澄电子科技有限公司
+86-755-27374946
info@bicheng-enterprise.com
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RO4003C Double Sided Rogers PCB Built on 60mil 1.524mm Substrate with Immersion Gold

Shipped: 2nd-Aug-2023  

We’re glad to introduce our newly shipped RF PCB. Designed for high-frequency applications, it delivers exceptional performance and reliability. Let's explore its impressive features:

The PCB material we use is Rogers RO4003C Hydrocarbon Ceramic woven glass, ensuring excellent signal integrity even under demanding conditions. It operates reliably in a wide temperature range from -40°C to +85°C.
The 2-layer rigid PCB stackup consists of copper layers on both sides of a Rogers 4003C substrate, providing a perfect balance of conductivity and durability.
We pay attention to construction details, such as precise board dimensions (150.33mm x 155.41mm), allowing compatibility with your projects. With a minimum trace/space of 4/4 mils and a minimum hole size of 0.35mm, you can achieve high-density layout and easy integration of components. The finished board thickness is 1.6mm, offering strength and flexibility. The immersion gold surface finish ensures excellent solderability and corrosion resistance.
The RF PCB accommodates creative designs with 176 components, 444 pads, 262 thru-hole pads, 151 top SMT pads, 31 bottom SMT pads, 168 vias, and 91 nets. It provides ample room for wireless communication systems, radar applications, and high-frequency circuits.
You can supply the PCB artwork in Gerber RS-274-X format, compatible with popular design tools and manufacturing processes. The RF PCB adheres to the IPC-Class-2 quality standard, ensuring reliability and performance.
No matter where you are located, our RF PCB is available worldwide. For any technical questions or assistance, our dedicated team is ready to help. Simply reach out to us at sales@bicheng-enterprise.com.
 
 

Parameter

Value

PCB Material

Rogers RO4003C Hydrocarbon Ceramic woven glass

Operating Temperature

-40°C to +85°C

Stackup

 

 

 

2-layer rigid PCB stackup with copper layers and Rogers 4003C substrate

Copper_layer_1 - 70 μm

substrate (Rogers 4003C) - 1.524 mm

Copper_layer_2 - 70 μm

Board Dimensions

150.33mm x 155.41mm

Minimum Trace/Space

4/4 mils

Minimum Hole Size

0.35mm

Finished Board Thickness

1.6mm

Outer Layer Copper Weight

2oz (2.8 mils)

Via Plating Thickness

25.4μm

Surface Finish

Immersion Gold

RF PCB Statistics

 

 

 

 

 

 

Components: 176

Total Pads: 444

Thru-hole Pads: 262

Top SMT Pads: 151

Bottom SMT Pads: 31

Vias: 168

Nets: 91

Artwork Format

Gerber RS-274-X

Quality Standard

IPC-Class-2

Worldwide Availability

Available worldwide

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