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RO3003 Multi-layer High Frequency PCB Built on 8-layer Stackup with 2929 Bondly and Immersion Gold

Shipped: 1st-Aug-2023

We are pleased to announce the arrival of our newly shipped RF PCBs, designed to take your projects to the next level of connectivity. With a focus on quality and performance, these PCBs are engineered to deliver exceptional results in RF applications. Let's dive into the details and explore the features of this impressive offering.

PCB Material: Unwavering Performance with Rogers RO3003 The RF PCBs are constructed using Rogers RO3003 ceramic-filled PTFE composites. This advanced material boasts a dielectric constant of 3.0 at 10 GHz (23°C) and a dissipation factor of 0.001 at the same frequency and temperature. These properties ensure excellent signal integrity and minimal loss, allowing your RF designs to shine. Furthermore, the operational temperature range of -40℃ to +85℃ guarantees reliable performance even in challenging environments.

8-Layer Rigid Stackup: Unleash the Potential The RF PCBs feature an 8-layer rigid stackup that offers versatility and flexibility for your designs. Copper layers 1 to 8, each with a thickness of 18 μm, provide the perfect balance between conductivity and durability. Rogers 3003 substrates, measuring 0.127 mm each, offer a stable foundation for your RF circuits. The inclusion of bondply 2929 layers, with a thickness of 0.076 mm, ensures reliable bonding between the copper and substrate layers, enhancing the overall integrity of your PCB.

Construction Details: Precision and Reliability Attention to detail is at the heart of the RF PCBs. The board dimensions of 237mm x 70.1mm, with a tolerance of +/- 0.15mm, ensure precise fit and compatibility with your projects. A minimum trace/space ratio of 4/4 mils allows for high-density layout and gives you more room for creativity. With a minimum hole size of 0.4mm, you can easily accommodate various component types, enabling seamless integration into your designs. The inclusion of blind vias L5-L8 offers the freedom to create complex interconnections, enabling efficient signal routing across different layers. The finished board thickness of 1.0mm strikes the perfect balance between strength and flexibility, ensuring optimal performance. Finished Cu weight of 0.5 oz (0.7 mils) for inner layers and 1 oz (1.4 mils) for outer layers provides the necessary conductivity for your RF designs. A via plating thickness of 1 mil ensures reliable and consistent signal transmission. The RF PCBs are finished with immersion gold, offering excellent solderability and corrosion resistance, even in demanding environments. The top and bottom silkscreens in white add a professional touch to your designs, while the green solder mask protects against solder bridging. Silkscreening on solder pads is strictly prohibited to ensure optimal soldering results. Each PCB undergoes a comprehensive electrical test, ensuring that it meets the highest quality standards. With 190 components, 248 total pads, 151 thru-hole pads, 73 top SMT pads, 24 bottom SMT pads, 219 vias, and 125 nets, these RF PCBs provide ample opportunities for creative and intricate designs.

IPC-Class-2 Quality Standard: Reliability You Can Trust The RF PCBs adhere to the IPC-Class-2 quality standard, guaranteeing reliability and performance that meet industry benchmarks. With our commitment to delivering exceptional products, you can trust that these PCBs will exceed your expectations.

Worldwide Availability: Connect Anywhere, Anytime We are excited to offer these RF PCBs with worldwide availability. No matter where you are, you can benefit from their advanced features and capabilities. Seize the opportunity to connect with the world and bring your RF designs to life.

Technical Support: Assistance at Your Fingertips We understand that technical questions can arise during the design and implementation process. To ensure a smooth experience, our dedicated team is available to provide expert technical support. If you have any inquiries or need assistance, please don't hesitate to contact us at sales@bicheng-enterprise.com. We are here to help you achieve success with your RF projects.

Specification	Value
PCB Material	Rogers RO3003
Dielectric Constant	3.0 at 10 GHz (23°C)
Dissipation Factor	0.001 at 10 GHz (23°C)
Operational Temperature Range	-40°C to +85°C
Stackup	8-Layer Rigid
	Copper_layer_1 - 18 μm
	substrate_1 (Rogers 3003) - 0.127 mm
	Copper_layer_2 - 18 μm
	bondply 2929 - 0.076 mm
	Copper_layer_3 - 18 μm
	substrate_2 (Rogers 3003) - 0.127 mm
	Copper_layer_4 - 18 μm
	bondply 2929 - 0.076 mm
	Copper_layer_5 - 18 μm
	substrate_3 (Rogers 3003) - 0.127 mm
	Copper_layer_6 - 18 μm
	bondply 2929 - 0.076 mm
	Copper_layer_7 - 18 μm
	substrate_4 (Rogers 3003) - 0.127 mm
	Copper_layer_8 - 18 μm
Copper Layer Thickness	18 μm
Substrate Thickness	0.127 mm
Bondply Thickness	0.076 mm
Board Dimensions	237mm x 70.1mm
Tolerance	+/- 0.15mm
Minimum Trace/Space Ratio	4/4 mils
Minimum Hole Size	0.4mm
Blind Vias	L5-L8
Finished Board Thickness	1.0mm
Inner Layer Cu Weight	0.5 oz (0.7 mils)
Outer Layer Cu Weight	1 oz (1.4 mils)
Via Plating Thickness	1 mil
Surface Finish	Immersion gold
Silkscreen Color	White
Solder Mask Color	Green
Electrical Test	100%
Components	190
Total Pads	248
Thru-Hole Pads	151
Top SMT Pads	73
Bottom SMT Pads	24
Vias	219
Nets	125
Quality Standard	IPC-Class-2
Worldwide Availability	Yes

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