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RO3010 Double Sided, Dual Layer High Frequency PCB Built on 50mil (1.27mm) Rogers Substrate with Immersion Gold Techniques

Shipped: 30th-June-2023

We are excited to introduce our latest high frequency PCB, meticulously manufactured for high-frequency and high-speed applications.

It is a double-sided 2-layer board made of premium Rogers RO3010 material with a lead-free process, ensuring reliable performance even in extreme temperature conditions ranging from -40℃ to +85℃.

The robust stackup includes a base copper of 18um with plating, a RO3010 core measuring 50mil (1.27mm), and another base copper of 18um with plating. The finished board dimensions measure 100mm x 106mm=1 PCS, with a finished board thickness of 1.44mm and a finished Cu weight of 1.0 oz (1.4 mils) across all layers. The via plating thickness is 1mil, and the surface finish is Electroless Nickle and Immersion Gold (ENIG).

This PCB features a minimum trace/space of 7/7 mils, ensuring precise signal transmission, and a minimum hole size of 0.3mm, providing adequate space for components to pass through. The board includes 30 components, 77 total pads, 53 thru-hole pads, 24 top SMT pads, and 87 vias, providing versatility and flexibility for various applications. The board undergoes 100% electrical testing, ensuring optimal performance and reliability.

The impedance matching is not included in this board, but it still delivers outstanding performance. The board has no top or bottom silkscreen and no top or bottom solder mask, ensuring a clean and sleek appearance.

For any technical inquiries, our team of experts is always ready to assist you. Please contact us at sales@bicheng-enterprise.com.

Specification	Value
PCB Material	Rogers RO3010
Lead-Free Process	Yes
Operating Temperature Range	-40℃ to +85℃
Stackup	Double-sided 2-layer PCB
	- base copper 18um + plating
	- RO3010 Core 50mil (1.27mm)
	- base copper 18um+ plating
Base Copper	18um
RO3010 Core Thickness	50mil (1.27mm)
Prepreg	No
Finished Board Dimensions	100mm x 106mm=1 PCS, +/- 0.15mm
Minimum Trace/Space	7/7 mils
Minimum Hole Size	0.3mm
Blind/Buried Vias	No
Finished Board Thickness	1.44 mm
Finished Cu Weight	1.0 oz (1.4 mils) all layers
Via Plating Thickness	1 mil
Surface Finish	Electroless Nickle and Immersion Gold (ENIG)
Top Silkscreen	No
Bottom Silkscreen	No
Top Solder Mask	No
Bottom Solder Mask	No
Electrical Test	100%
Impedance Matching	No
Components	30
Total Pads	77
Thru-Hole Pads	53
Top SMT Pads	24
Bottom SMT Pads	0
Vias	87
Nets	6

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