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RO4003C Double Sided Rogers PCB Multiple Prototypes Built on 20mil (0.508mm) With Immersion Gold ENIG and Via Filled Techniques

Shipped: 28th-June-2023

The newly shipped RF PCB is a high-quality double-sided 2-layer board launched for RF applications. It meets strict quality standards and is made of Rogers RO4003C material with a lead-free process, making it suitable for operating temperatures ranging from -40℃ to +85℃.

The board construction features a stackup with a base copper of 18um, plating, RO4003C core measuring 20mil (0.508mm), and another base copper of 18um, plating. The board dimensions measure 196mm x 180mm=7 Types=8 PCS, with a finished board thickness of 0.68mm and a finished Cu weight of 1.0 oz (1.4 mils) across all layers. The via plating thickness is 1mil, and the surface finish is Electroless Nickle and Immersion Gold (ENIG).

The board specifications include a minimum trace/space of 5/7 mils and a minimum hole size of 0.5mm. There are no blind/buried vias, and the board has 90 components, 167 total pads, 73 thru-hole pads, 94 top SMT pads, and 99 vias. The board undergoes 100% electrical testing, with slotted holes defined as per Gerber plated through. All edges are tab-routed, and all non-plated holes for breakouts are included in Gerbers. Breakouts are shown as per design FabDrawing.

The board's impedance matching is not included, and the 0.5mm via is filled by resin and capped by copper by IPC-4761 Type VII. The board has no top or bottom silkscreen, and the top and bottom solder masks are not included.

For any technical inquiries, please contact us at sales@bicheng-enterprise.com.

Specification	Value
PCB Material	Rogers RO4003C
Lead-Free Process	Yes
Operating Temperature Range	-40℃ to +85℃
Stackup	Double sided 2-layer PCB
	- base copper 18um + plating
	- RO4003C Core 20mil (0.508mm)
	- base copper 18um+ plating
Base Copper	18um
RO4003C Core Thickness	20mil (0.508mm)
Prepreg	No
Finished Board Dimensions	196mm x 180mm=7 Types=8 PCS, +/- 0.15mm
Minimum Trace/Space	5/7 mils
Minimum Hole Size	0.5mm
Blind/Buried Vias	No
Finished Board Thickness	0.68mm
Finished Cu Weight	1.0 oz (1.4 mils) all layers
Via Plating Thickness	1mil
Surface Finish	Electroless Nickle and Immersion Gold (ENIG)
Top Silkscreen	No
Bottom Silkscreen	No
Top Solder Mask	No
Bottom Solder Mask	No
Electrical Test	100%
Slotted Holes	Defined as per Gerber and plated through
Edges	Tab-routed
Non-Plated Holes for Breakouts	Included in Gerbers
Impedance Matching	No
Via Filling	0.5mm via filled by resin and capped by copper by IPC-4761 Type VII
Components	90
Total Pads	167
Thru-Hole Pads	73
Top SMT Pads	94
Bottom SMT Pads	0
Vias	99
Nets	35

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